Panasonic Corporation

Ryuuzou Houtin

Hiroyuki Suzuki

Shogo Okita

Syouzou Watanabe

A plasma etching apparatus includes a pressure-reducible chamber, a placement sectionfor supporting an object to be treated within the chamber, a dielectric memberfor sealing an upper opening of the chamber, and a coilprovided outside the dielectric member. The coilgenerates a plasmain the chamberby inductive coupling so that the objectis subjected to etching. The dielectric memberhas recess portionsdiscontinuous to one another. Portions of the dielectric memberform large-thickness portions. A thickness of the dielectric memberin the recess portionsis smaller than a thickness of the large-thickness portions. The recess portionsare placed according to distribution densities of conductors constituting the coil

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Osaka, Japan

Ryuuzou Houtin