Nitto-denko Corporation

Ryuusuke Naitou

Amane Mochizuki

Kazunori Mune

Hideyuki Usui

Yusuke Shimizu

Takahiro Fukuoka

Atsushi Hino

Naoki Sadayori

Kenichi Yamashita

Mika Horiike

Kunishige Oe

The invention provides a process of manufacturing an optical waveguide for optically connecting a plurality of optical devices, comprising the steps of: disposing a resin composition between two or more optical devices, the resin composition comprising a resin and a 1,4-dihydropyridine derivative, forming an optical path through the resin composition between the optical devices by light having a wavelength capable of inducing a structural change in the 1,4-dihydropyridine derivative, and removing the 1,4-dihydropyridine derivative from the resulting resin composition. Also disclosed is a connection structure obtained by the process.

Process of manufacturing optical waveguide and connection structure of optical devices

The present invention provides a process for producing an electro-optic hybrid circuit board, which comprises the steps of: forming an undercladding layer on a metal foil side of a metal transfer sheet that comprises a releasable substrate and a metal foil formed thereon; forming a core layer on the undercladding layer; forming an overcladding layer so as to cover the core layer and the undercladding layer; stripping the releasable substrate from the metal foil; and etching the metal foil to thereby form a predetermined conductor pattern.

Process for producing electro-optic hybrid circuit board

The present invention provides a process for producing an optical waveguide, comprising the steps of: continuously applying a fluorene derivative layer onto a continuous substrate and curing the layer to thereby form a lower cladding layer; continuously applying a photosensitive fluorene derivative layer onto the lower cladding layer; continuously exposing the applied photosensitive fluorene derivative layer to a light through a photomask having a predetermined pattern; continuously subjecting the exposed photosensitive fluorene derivative layer to post-exposure heating; continuously developing the heated photosensitive fluorene derivative layer to remove the unexposed areas therein, thereby forming into the predetermined pattern; curing the developed photosensitive fluorene derivative layer to thereby form a core layer having the predetermined pattern on the lower cladding layer; and continuously applying a fluorene derivative layer over the lower cladding layer so as to cover the core layer and curing the fluorene derivative layer to thereby form an upper cladding layer.

Process for producing optical waveguide

The present invention provides a process for producing an optical waveguide which comprises: disposing on an undercladding layer at least one member for forming an optical-path deflection plane; forming a photosensitive resin layer over the undercladding layer so as to at least partly cover the member for forming an optical-path deflection plane; subjecting the photosensitive resin layer to exposure and then development to thereby form at least one core layer; and forming an overcladding layer over the undercladding layer so as to cover the at least one core layer.

The invention provides an electro-optic hybrid circuit board having an optical waveguide superposed on a wiring circuit board, the electro-optic hybrid circuit board comprising: an insulating layer; a conductor pattern formed on the insulating layer; an undercladding layer formed on the conductor pattern-having insulating layer so as to surround the conductor pattern; a core layer formed on the undercladding layer; and an overcladding layer formed to cover the core layer and the undercladding layer.

Electro-optic hybrid circuit board

The present invention provides a process for producing a flexible optical waveguide which comprises the steps of: immersing a substrate having an optical waveguide formed thereon in water to thereby reduce adhesion between the optical waveguide and the substrate and then peeling the optical waveguide from the substrate; temporarily bonding the peeled optical waveguide to a surface of a pressure-sensitive adhesive layer containing a foaming agent; cutting the temporarily bonded optical waveguide into a given length; allowing the foaming-agent-containing pressure-sensitive adhesive layer after the cutting step to foam by heating, thereby reducing adhesion between the foaming-agent-containing pressure-sensitive adhesive layer and the optical waveguide; and peeling the optical waveguide cut into the given length from the foamed adhesive layer.

Process for producing flexible optical waveguide

This invention provides a process for producing a three-dimensional polyimide optical waveguide, which comprises: (I) irradiating a polyamic acid film with a laser beam while converging the laser beam at an inside portion of the film and relatively moving the light convergence point, the polyamic acid film containing: (a) a polyamic acid obtained from a tetracarboxylic dianhydride and a diamine; and (b) per 100 parts of the polyamic acid, from 0.5 part by weight to less than 10 parts by weight of a specific 1,4-dihydropyridine derivative represented by formula (I): and then, (II) heating the polyamic acid film to imidize the polyamic acid, thereby obtaining an optical waveguide having a continuous core region where the refraction index has been changed, in the thus formed polyimide film.

Process for producing three-dimensional polyimide optical waveguide

Process for producing polyimide optical waveguide

A process of producing a polymer optical waveguide, including (a) a step of forming an undercladding layer on a substrate; (b) a step of forming a photosensitive resin composition layer containing a 1,4-dihydropyridine derivative and a resin on the undercladding layer; (c) a step of irradiating a region of the photosensitive resin composition layer corresponding to a core pattern with UV light through a mask to form UV light-exposed areas and UV light-unexposed areas on the photosensitive resin composition layer; (d) a step of heating the UV light-exposed areas and UV light-unexposed areas of the photosensitive resin composition layer; and (e) a step of forming an overcladding layer on the photosensitive resin composition layer after heating.

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Osaka, Japan

Ryuusuke Naitou