Kyocera Corporation

Ryuuji Mori

Toshihiro Hashimoto

Yuusuke Takei

The present invention relates to a sensor wiring substrate in which a decrease in detection accuracy is suppressed, a sensor package, and a sensor device. A gas sensor wiring substrate includes a substrate having a first accommodation recessed portion for accommodating a microphone element and a second accommodation recessed portion for accommodating an infrared light emitting element, and connection wiring. In the gas sensor wiring substrate, thermal resistance of a heat transfer path between a bottom surface of the first accommodation recessed portion and a bottom surface of the second accommodation recessed portion is greater than thermal resistance in any position of an imaginal heat transfer path in case of a depth of the first accommodation recessed portion identical with a depth of the second accommodation recessed portion. For example, the depth of the second accommodation recessed portion is deeper than the depth of the first accommodation recessed portion.

Sensor wiring substrate, sensor package, and sensor device

A lid body includes a plate body containing silicon; a protective film disposed on a main surface of the plate body, the protective film protecting the plate body from a joining brazing material; a frame-like hole passing through the protective film, the frame-like hole being provided at an outer periphery of the protective film; and a sealing metallic layer made of metal, disposed so as to fill in the hole.

Lid body, package, and electronic apparatus

A reacting apparatus includes a reactor having a supply port and a discharge port, a first member connected to the surface of the reactor having a through hole associated with the supply port, and a second member connected to the surface of the reactor and having a through hole associated with the discharge port, a supply pipe connected to the supply port by way of the through hole of the first member, to supply a fluid before the reaction to the supply port, and a discharge pipe connected to the discharge port by way of the through hole of the second member, to discharge a fluid after the reaction from the discharge port. The supply port and discharge port include a portion covered by a surface of the first member and a portion communicating with the through hole of the first member. The discharge port includes a portion covered by a surface of the second member and a portion communicating with the through hole of the second member. A first opening of the through hole of the first member includes a portion covered by the surface of the reactor and a portion communicating with the supply port. A second opening of the through hole of the second member includes a portion covered by the surface of the reactor and a portion communicating with the discharge port.

Growing community of inventors

Kirishima, Japan

Ryuuji Mori