Hitachi, Ltd.

Hitachi-high-technologies Corporation

Hitachi-lg Data Storage, Inc.

Ryuta Washiya

Masahiko Ogino

Akihiro Miyauchi

Kyoichi Mori

Noritake Shizawa

Takashi Ando

Akio Yabe

Shiro Nagashima

Masaki Sugita

The present invention is characterized in that a filter made of resin comprises a through-hole film portion (); and a structure reinforce portion (), wherein a through-hole () is provided in a through-hole film portion (), the thickness of the through-hole film portion () is from 0.5 to 2.0 &#x3bc;m, the bore of the through-hole () is from 0.05 to 0.5 &#x3bc;m, the thickness of the structure reinforce portion () is bigger than the thickness of the through-hole film portion (), the structure reinforce portion () encloses the through-hole film portion (), a damage-reduction structure is provided on the upper surface of the structure reinforce portion (), and wherein, the damage-reduction structure may be an uneven structures.

Filter and method of the same

Provided are a method for forming a microfine structure and a microfine structure forming body prepared by the method. The method allows a remaining film part to be formed thinner and more uniform on a substrate than the conventional techniques. The method comprises the steps of: forming an oxide layer on a metallic thin film; a photocurable resin layer via first and second adhesive layers over the oxide layer; and transferring a microfine structure formed on a mold by pressing the mold onto the photocurable resin layer. The first adhesive layer includes a compound having at least two hydrolysable functional groups, and the second adhesive layer includes a compound having at least a hydrolysable functional group and a reactive functional group.

Microfine structure formation method and microfine structure formed body

A microstructure transferring device is characterized in that the device comprises a stamper made from a first photo-curable resin composition cured with light with a first wavelength, and a light source emitting light with a second wavelength longer than the first wavelength. The microstructure is transferred to an impression receptor supplied with a second photo-curable resin composition, which is curable with light with the second wavelength emitted by the light source.

Device and method for transferring micro structure

A method of imprinting a microstructure comprising: contacting a stamper comprising a pattern layer with the microstructure of the order of from micrometers to nanometers in one face of the pattern layer and a substrate supporting the pattern layer with an imprinting member having a deformable layer to which the microstructure is imprinted, wherein the pattern layer is supported on a round surface having a prescribed radius of curvature of the substrate, the center of the round surface protruding towards the rear face of the pattern layer; causing the deformable layer on the imprinting member; and separating the stamper from the cured deformable layer.

Method and apparatus for imprinting microstructure and stamper therefor

In a micropattern transfer device, a stamper on which a fine indented pattern is formed is brought into contact with a material to be transferred, and the fine indented pattern on the stamper is transferred onto a surface of the material to be transferred. The micropattern transfer device includes a holding mechanism which holds an entire outer circumferential portion of the material to be transferred. The holding mechanism holds the material to be transferred such that a distance between the material to be transferred and the stamper is substantially equal to or shorter than a distance between the holding mechanism and the stamper.

Growing community of inventors

Hitachi, Japan

Ryuta Washiya