Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Mec Company Ltd.

Ryuta Ohsuka

Koji Nitta

Shoichiro Sakai

Akira Tsuchiko

Yu Fukui

Kenji Nishie

Masaharu Yasuda

Koji Kasuya

Yoshihito Yamaguchi

Junichi Okaue

A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.

Regenerating method of removal liquid and regenerated removal liquid preliminary

In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer () is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.

Method of manufacturing printed circuit board

According to one aspect of the present invention, a printed circuit board includes: an insulating base film; a conductive pattern that is partially layered on a surface side of the base film; a coating layer that is layered on a surface of a layered structure including the base film and the conductive pattern and having an opening portion that partially exposes the conductive pattern; and a tin plating layer that is layered on a surface of the conductive pattern exposed from the opening portion, wherein an average peel length of the coating layer from the conductive pattern with an inner edge of the opening portion as a base end is less than or equal to 20 &#x3bc;m.

Printed circuit board and method of manufacturing printed circuit board

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Osaka, Japan

Ryuta Ohsuka