Seiko Instruments Inc

Agency for Science, Technology and Research

Ryuta Mitsusue

Hiroshi Takahashi

Yasuyuki Mitsuoka

Rakesh Kumar

Yoshifumi Yoshida

Won Kyoung Choi

Nagarajan Ranganathan

Fumio Kimura

Ebin Liao

Ryohei Kamiya

Chirayarikathu Veedu Sankarapillai Premachandran

In an embodiment, a wafer level package may be provided. The wafer level package may include a device wafer including a MEMS device, a cap wafer disposed over the device wafer, at least one first interconnect disposed between the device wafer and the cap wafer and configured to provide an electrical connection between the device wafer and the cap wafer, and a conformal sealing ring disposed between the device wafer and the cap wafer and configured to surround the at least one first interconnect and the MEMS device so as to provide a conformally sealed environment for the at least one first interconnect and the MEMS device, wherein the conformal sealing ring may be configured to conform to a respective suitable surface of the device wafer and the cap wafer when the device wafer may be bonded to the cap wafer. A method of forming a wafer level package may also be provided.

Wafer level package and a method of forming a wafer level package

An electrostatic vibrator has a vibrating plate including beam-shaped vibrating parts each fixed at opposite ends thereof and configured for electrostatic actuation to perform flexural vibration, and temperature compensation parts connected to the vibrating parts. A silicon oxide film covers each of the vibrating parts but not the temperature compensation parts. A substrate is mounted in parallel relation to the vibrating plate. An oxide layer is disposed between the substrate to the vibrating plate. Electrodes are formed on the substrate and arranged on opposite sides of each of the vibrating parts.

Electrostatic vibrator and electronic apparatus

Growing community of inventors

Chiba, Japan

Ryuta Mitsusue