Tanaka Kikinzoku Kogyo K.k.

Kyocera Corporation

Ryuta Ido

Junichi Takeuchi

Takumi Niitsuma

Hideya Takahashi

Yoshinori Aoyama

Harumi Takeoka

Kazuharu Yoshida

The present invention is a clad material for an electric contact, including a base material composed of a Cu-based, precipitation-type age-hardening material, and a contact material composed of an Ag alloy bonded to the base material. On a bonded interface between the contact material and the base material, a width of a diffusion region including Ag and Cu is 2.0 &#x3bc;m or shorter. The clad material is produced by bonding each other the contact material and the base material having undergone solutionizing and age-hardening beforehand, suppressing the diffusion region from expanding after bonding. The present invention is capable of providing an electric contact, which achieves higher conductivity, without sacrificing property of the Cu-based, precipitation-type age-hardening material.

Clad material for electric contacts and method for producing the clad material

An object of the present invention is to provide a seal ring having a metal brazing material layer on one surface of a base material containing KOVAR and a metal plating layer on the other surface, ensuring that the seal ring can prevent generation of a stain on the surface of a metal plating layer and excellent airtightness of an electronic component housing package can be achieved. The present invention has attained the object above by a seal ring which is an annular sealing ring having a nickel layer on the first surface of a base material containing KOVAR (iron-nickel-cobalt alloy) and a metal brazing material layer on the second surface opposite the first surface, wherein the thickness of the nickel layer is from 0.1 to 20 &#x3bc;m.

Seal ring, electronic component housing package, electronic device, and manufacturing methods thereof

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Oshu, Japan

Ryuta Ido