Mitsubishi Engineering-plastics Corporation

Mitsubishi Gas Chemical Company, Inc.

Japan Polyethylene Corporation

Ryusuke Yamada

Takahiro Takano

Tatsuya Kikuchi

Yasushi Yamanaka

Kei Takahashi

Tomonori Kato

Satoshi Nagai

Hatsuki Oguro

Masayuki Nagai

Kunihiko Fujimoto

Yuki Hiwatashi

Masahide Sugiyama

A thermoplastic resin composition contains 10 to 90% by mass of (A) thermoplastic resin; 1 to 20% by mass of (B) laser direct structuring additive; and 0.3 to 7.0% by mass of (D) graphite, a total of the ingredient (A), the ingredient (B) and the ingredient (D) being always kept at 100% by mass or below, and a ratio by mass given by ingredient (B)/ingredient (D) being 1.0 to 20.

Thermoplastic resin composition, molded article, method for manufacturing thermoplastic resin composition, and, method for manufacturing plated molded article

Provided is a polyamide resin composition capable of providing a molded article having an excellent wear resistance while maintaining a high mechanical strength; a molded article; and a method for manufacturing a polyamide resin pellet. The polyamide resin composition includes a polyamide resin and an inorganic filler, wherein the polyamide resin includes diamine-derived constituent units and dicarboxylic acid derived constituent units; 70 mol % or more of the diamine-derived constituent units are derived from 1,4-bis(aminomethyl)cyclohexane; a molar ratio of cis:trans of the 1,4-bis(aminomethyl)cyclohexane is from 35:65 to 0:100; 70 mol % or more of the dicarboxylic acid-derived constituent units are derived from an &#x3b1;,&#x3c9;-linear aliphatic dicarboxylic acid having from 8 to 12 carbons; and the polyamide resin includes phosphorus atoms in a ratio of from 20 to 100 mass ppm and comprises calcium atoms so as to be phosphorus atoms:calcium atoms of 1:0.3 to 0.7 in a molar ratio.

Polyamide resin composition, molded article, and method for manufacturing polyamide resin pellet

Provided is a polyamide resin composition capable of yielding highly abrasion-resistant molded article, while keeping high mechanical strength, and, a molded article using the polyamide resin composition. The polyamide resin composition contains (A) polyamide resin, (B) polyolefin wax, and (C) at least one metal salt selected from alkali metal salt and alkali earth metal salt, and the (A) polyamide resin contains (a-1) semiaromatic polyamide resin.

Polyamide resin composition and molded article

Provided is a resin molding that uses a resin composition capable of achieving high platability, while being imparted flame retardant by the halogen-containing flame retarder, a method for manufacturing a plated resin molding, and a method for manufacturing an antenna-equipped portable electronic device part. The resin composition comprises 100 parts by weight of a thermoplastic resin; 5 to 100 parts by weight of a halogen-containing flame retarder; and, 1 to 30 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive contains antimony, and; a content of an antimony-containing flame retarder auxiliary is 0.5 parts by weight or less per 100 parts by weight of the thermoplastic resin.

Resin composition, resin molding, method for manufacturing plated resin molding, and method for manufacturing antenna-equipped portable electronic device part

Provided is resin molded articles having large elastic modulus, and good appearance. A thermoplastic resin composition contains 80 to 120 parts by weight of a carbon fiber and 0.1 to 3.0 parts by weight of a black colorant, per 100 parts by weight of a (A) crystallizable thermoplastic resin which shows a semicrystallization time (ST (P)) of 20 to 500 seconds, wherein the semicrystallization time is measured by depolarization photometry, under conditions that a sample melting temperature is 20 to 40&#xb0; C. higher than a melting point of the crystallizable thermoplastic resin, a sample melting time is 3 minutes, and an oil bath temperature for crystallization is 140&#xb0; C.

Crystallizable thermoplastic resin composition and molded article

Making formation of a plated layer on a surface of a resin molded article possible, without adding the LDS additive to the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, the composition comprising a water-compatible organic substance, water, and a laser direct structuring additive. Further provided is a kit having the composition for forming a laser direct structuring layer and a method for manufacturing a resin molded article with a plated layer, which uses the composition for forming a laser direct structuring layer.

Composition for forming laser direct structuring layer, kit, and method for manufacturing resin molded article with plated layer

The invention is a polyacetal resin composition containing a polyacetal resin (A) and a polyethylene resin (B), in which the blending proportion of the polyacetal resin (A) occupying in the total mass of the polyacetal resin (A) and the polyethylene resin (B) is 10 to 90 mass %, the melt flow rate of the polyacetal resin (A) measured at a condition of 190&#xb0; C. and 2.16 kg load is 30 g/10 minutes or less, and the polyethylene resin (B) consists of a modified polyethylene resin and the modification rate is 0.01 mass % or more based on 100 mass % of the total mass of the polyethylene resin and the melt flow rate of the polyethylene resin (B) measured at a condition of 190&#xb0; C. and 2.16 kg load is 2.5 g/10 minutes or less.

Polyacetal resin composition, composite molding using the same, and method for producing the same

Provided is a resin composition having higher platability. The resin composition contains at least two kinds of metals and also containing a conductive oxide having a resistivity of 5&#xd7;10&#x3a9;&#xb7;cm or less.

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Hiratsuka, Japan

Ryusuke Yamada