Nitto-denko Corporation

Ryusuke Naito

Yuichi Tsujita

Yusuke Shimizu

Masayuki Hodono

Akiko Nagafuji

Naoki Shibata

Mitsuru Honjo

Kazuhiro Fuke

Masami Inoue

Kei Nakamura

Emiko Tani

Hidenori Onishi

Toru Mizutani

Naoko Yoshida

Yuichi Fukamichi

An optical semiconductor device includes a metal lead frame including first and second plate portions, an optical semiconductor element mounted on the metal lead frame, and a reflector provided around the optical semiconductor element. A material for the reflector is an epoxy resin composition containing: (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) at least one of a carboxylic acid and water. Components (C) and (D) are present in a total proportion of 69 to 94 wt % based on the amount of the overall epoxy resin composition, and the component (E) is present in a proportion of 4 to 23 mol % based on the total amount of the components (B) and (E). The resin composition has a higher glass transition temperature, and is excellent in moldability and blocking resistance and substantially free from warpage.

Epoxy resin composition for optical semiconductor device, and lead frame for optical semiconductor device, encapsulation type optical semiconductor element unit and optical semiconductor device each obtainable by using the epoxy resin composition

A method of manufacturing an optical waveguide is provided which enables a recognition device such as a CCD camera to easily recognize an alignment mark for positioning a mold for over cladding layer formation. The method includes the steps of: forming protruding cores and a protruding alignment mark on an upper surface of an under cladding layer on a substrate by a photolithographic method; and forming the over cladding layer by use of the mold positioned using the alignment mark as a guide. For the formation of the alignment mark, a photomask is used which has an opening pattern for alignment mark formation including an opening, and a light transmission amount reduction region provided around the opening and having an aperture ratio within a range greater than 10% and less than 80%. The alignment mark is formed to have a peripheral side surface in the form of an inclined surface.

Method of manufacturing optical waveguide

An optical connector reduced in size and capable of reducing optical coupling losses when optical waveguides are connected to each other, and a method of manufacturing the same are provided. The optical connector comprises: an optical waveguide including cores for transmitting light, an under cladding layer provided under the cores, and an over cladding layer provided over the cores; and a ferrule section for optical connection provided in each end portion of the optical waveguide. Part of at least one of the over cladding layer and the under cladding layer lying in a location corresponding to each end portion of the optical waveguide is thick-walled to become the ferrule section for optical connection. A thin-walled part of the optical connector lying between the ferrule sections is an optical waveguide section. The optical connector requires no additional component as a ferrule, and is made small in size.

Optical connector and method of manufacturing same

A method of manufacturing an optical waveguide is provided in which a mold that prevents fins or burrs from being formed is used for the formation of an over cladding layer in the optical waveguide. The mold for the formation of the over cladding layer is produced from a light-transmissive resin by molding using a mold member including a protruding portion identical in shape with the over cladding layer and a ridge portion provided around the protruding portion. For the formation of the over cladding layer, the cavity is filled with a photosensitive resin for the formation of the over cladding layer, and the photosensitive resin is cured by being exposed to light through the mold while cores formed on a surface of an under cladding layer are immersed in the photosensitive resin and part of the photosensitive resin spilling out of the cavity is collected in the groove.

A mold for the formation of an over cladding layer in an optical waveguide is integrally produced from a light-transmissive resin and a light-transmissive support plate by molding using a mold member identical in shape with the over cladding layer. In the production of the mold, a hollow resulting from the removal of the mold member serves as a cavity for the formation of the over cladding layer. For the formation of the over cladding layer, the cavity of the mold is filled with a photosensitive resin for the formation of the over cladding layer, and the photosensitive resin is cured by being exposed to light through the mold while cores formed in a pattern on a surface of an under cladding layer are immersed in the photosensitive resin.

An optical waveguide production method, employs a light-transmissive mold having higher dimensional accuracy for formation of an over-cladding layer. The mold for the formation of the over-cladding layer is unitarily produced by molding a light-transmissive resin with the use of a mold component having the same shape as the over-cladding layer. A recess formed in the mold by removing the mold component in the production of the mold serves as a cavity for the formation of the over-cladding layer. For the formation of the over-cladding layer, a photosensitive resin for the over-cladding layer is injected into the cavity of the mold, and exposed through the mold to be cured while a core formed in a predetermined pattern on a surface of an under-cladding layer is immersed in the photosensitive resin.

Optical waveguide production method

Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of the undercladding layer and the overcladding layer, and are located and formed at predetermined locations with respect to a light transmitting surface of a core. The electric circuit unit includes fitting holes into which the protruding portions fit, and are located and formed at predetermined locations with respect to the optical element.

Opto-electric hybrid board and manufacturing method therefor

An optical sensor module is provided in which an engagement portion of a board unit is fitted in a groove of an optical waveguide unit and, even with the single engagement portion, the board unit is stably supported. An optical sensor module includes an optical waveguide unit, and a board unit mounted with an optical element and coupled to the optical waveguide unit. The optical waveguide unit includes a single edge extension portion axially extending along one side edge of an over-cladding layer, a board unit engagement groove provided in the single edge extension portion, and a projection provided on a side wall of the vertical groove and kept in abutment against an engagement portion of the board unit. The board unit includes an engagement portion fitted in the vertical groove, which abuts against the projection within the vertical groove.

Growing community of inventors

Ibaraki, Japan

Ryusuke Naito