Fujibo Holdings, Inc.

Ryuma Matsuoka

Teppei Tateno

Hiroshi Kurihara

Hirohito Miyasaka

Yamato Takamizawa

Satsuki Narushima

Fumio Miyazawa

Yoshihide Kawamura

Yoshie Kanazawa

Takumi Mikuni

Keisuke Ochi

Tetsuaki Kawasaki

Miyasaka Hirohito

Tateno Teppei

Miyazawa Fumio

A polishing pad contains: a polishing layer having a polishing surface for polishing a workpiece; and a cushion layer disposed on the side of the polishing layer opposite from the polishing surface. With regard to the ratio (tan δ) of the storage elastic modulus E' to the loss elastic modulus E″ of the whole polishing pad, as obtained through dynamic viscoelasticity measurement using frequency dispersion (25° C.) in a bending mode, the ratio of the maximum value of tan δ measured at 100-1000 rad/s (tan δ) to the maximum value of tan δ measured at 1 to 10 rad/s (tan δ) is 0.75 to 1.30.

Polishing pad

A polishing pad is equipped with a polishing layer having a polyurethane sheet, wherein a tan δ peak value change rate determined by formula: tan δ peak value change rate=|tan δ peak−tan δ peak|/tan δ peak×100, is not more than 15%, where tan δ peakrepresents the peak value of the loss tangent tan δ, of the polyurethane sheet in a wet state after being immersed in water for three days, within a temperature range of 20-100° C. in a tensile mode under an initial load of 148 g with a strain range of 0.1% at a measurement frequency of 1.6 Hz, and tan δ peakrepresents the peak value of the loss tangent tan δ, of the polyurethane sheet in a dry state without being immersed in water, within a temperature range of 20-100° C. in a tensile mode under an initial load of 148 g with a strain range of 0.1% at a measurement frequency of 1.6 Hz.

Polishing pad and method for manufacturing same

A polishing pad includes: a polishing layer having a polyurethane sheet containing substantially spherical cells, wherein E'(90%)/E&#x2032;(30%) falls within a range of 0.4 to 0.7, where E&#x2032;(90%) represents a storage modulus of the polyurethane sheet that has been exposed to an environment with a temperature of 23&#xb0; C. and a relative humidity of 90%, as measured in a tension mode at 40&#xb0; C. with an initial load of 148 g, a strain range of 0.1%, and a measurement frequency of 1.6 Hz, and E&#x2032;(30%) represents a storage modulus of the polyurethane sheet that has been exposed to an environment with a temperature of 23&#xb0; C. and a relative humidity of 30%, as measured in a tension mode at 40&#xb0; C. with an initial load of 148 g, a strain range of 0.1%, and a measurement frequency of 1.6 Hz. Also provided is a method for manufacturing the polishing pad.

Provided are a method for producing a finish polishing pad and the polishing pad which allow formation of a stable film and enables polishing with fewer polishing scratches. The method includes the steps of: dissolving a composition for forming polyurethane resin film containing a polyurethane resin and an additive(s) in a solvent capable of dissolving the resin; removing an insoluble component(s) to make the content of the insoluble component(s) in the solution less than 1% by mass relative to the total mass of the composition; adding a poor solvent to the solution from which the insoluble component(s) has(have) been removed, followed by mixing, the amount of the poor solvent added being calculated according to a defined Formula 1; and forming a film from the mixture solution on the film formation substrate by a wet coagulation method, to thereby form the polyurethane resin film.

Polishing pad and method for producing polishing pad

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Saijo, Japan

Ryuma Matsuoka