Showa Denko K.k.

Toyota Jidosha Kabushiki Kaisha

Resonac Corporation

Ryujin Ishiuchi

Nobuyuki Takahashi

Ryohei Ito

Shotaro Itami

Masashige Tanaka

Hiroaki Sugita

Akifumi Tamura

Hiroyuki Majima

Hidekazu Kaneoka

Provided are: a resin composition for easily giving polishing pads which have a hardness suitable for chemical mechanical polishing and have voids of a desired size; a polishing pad produced from the resin composition; and a method for producing the polishing pad. The resin composition comprises a urethane (meth)acrylate (A), at least one unsaturated resin (B) selected from among vinyl ester resins and unsaturated polyester resins, an ethylenically unsaturated compound (C) which has an ethylenically unsaturated bond and is neither the urethane (meth)acrylate (A) nor the unsaturated resin (B), and a hollow object (D), wherein the mass ratio of the content of the urethane (meth)acrylate (A) to the content of the unsaturated resin (B), A:B, is 64:36 to 96:4 and the content of the hollow object (D) is 0.7-9.0 parts by mass per 100 parts by mass of the sum of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C).

Resin composition, polishing pad, and method for producing polishing pad

A friction stir welding method using a resin composition including: a monomer (A) having an ethylenically unsaturated bond; a thermosetting resin (B); a radical polymerization initiator (C); and a fiber reinforcing material (D), wherein the thermosetting resin (B) is an unsaturated polyester resin or a vinyl ester resin.

Resin composition, cured product thereof, and friction stir welding method

This invention is concerning a structure body containing inorganic particles having an average particle diameter of 6 mm to 50 mm, and 6 parts by mass to 40 parts by mass of a resin with respect to 100 parts by mass of the inorganic particles.

Structure body, sound absorbing material, sound insulating wall material, and manufacturing method of structure body

The present invention is an unsaturated polyester resin composition comprising an unsaturated polyester (a), a monomer (b) having one polymerizable carbon-carbon double bond, a monomer (c) having two or more of (meth)acrylate groups, a filler (d) having high thermal conductivity, a glass fiber (e), a low profile additive (f), a curing agent (g), and a polymerization inhibitor (h), wherein the ratio by weight of the ingredient (b) to the ingredient (c) is from 50:50 to 75:25 and the unsaturated polyester resin composition comprises 400 to 1400 parts by weight of the ingredient (d) based on the total 100 parts by weight of the ingredients (a), (b), and (c). This unsaturated polyester resin composition has excellent curing properties without losing storage stability which can be used to provide a cured product having a low mold shrinkage ratio and high thermal conductivity.

Unsaturated polyester resin composition and encapsulated motor

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Tokyo, Japan

Ryujin Ishiuchi