Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Works, Ltd.

Ryuji Takahashi

Shimpei Obata

Yasunori Hoshino

Shigetoshi Fujita

Takahiro Yamada

Yoshihiko Nakamura

Hiroyuki Shiraki

Koji Kishino

Hiroki Tamiya

Hidetsugu Motobe

Yasunori Ambe

Takeshi Koizumi

Tomo Muguruma

Shinya Arakawa

A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.

Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substrate

A thermosetting resin composition contains a thermosetting resin and an inorganic filler. The thermosetting resin includes a curing agent. A 3 mass % methyl ethyl ketone solution of the curing agent has a Gardner color scale of 15 or more. The content of the curing agent accounts for 10 mass % or more of a total solid content of the thermosetting resin composition.

Thermosetting resin composition, prepreg, metal-clad laminate, printed wiring board, film with resin, and metal foil with resin

A prepreg includes: a woven fabric base; and a semi-cured product of a resin composition, which fills an inside of the woven fabric base and coats a surface of the woven fabric base. The resin composition includes a thermosetting resin, an inorganic filler, a first thermoplastic resin soluble in an organic solvent, and a second thermoplastic resin insoluble in an organic solvent. With respect to 100 parts by mass of the thermosetting resin, a content ratio of the inorganic filler ranges from 50 parts by mass to 150 parts by mass, inclusive, and a total content ratio of the first thermoplastic resin and the second thermoplastic resin ranges from 20 parts by mass to 50 parts by mass, inclusive.

Prepreg, metal-clad laminate and printed wiring board

An epoxy resin composition for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, is provided. The composition features: (A) a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule; (B) a reaction product of a phosphorous compound, a bifunctional epoxy resin, and an optional multifunctional epoxy resin, provided in an amount of 20% to 55% by mass, based on the total amount of epoxy resin, including (A) and (B); (C) a curing agent of dicyandiamide and/or a multifunctional phenolic compound; and (D) an inorganic filler blend containing an inorganic filler with a thermal decomposition temperature of 400&#xb0; C. or above. The composition does not generate toxic substances when combusted and has excellent ignition resistance, solder heat resistance after moisture absorption, and high temperature rigidity.

Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board

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Fukushima, Japan

Ryuji Takahashi