Toray Industries, Inc.

Ryuji Sawaoka

Toshio Muraki

Shinji Kouchi

Masato Honma

Atsuki Tsuchiya

Hiroki Oosedo

Shunsaku Noda

Toshiya Kamae

Shiro Honda

Masahiko Hayashi

Tokuo Tazaki

Toshiaki Higashi

Koyomi Nakahara

Naomi Miyoshi

Masazumi Tokunou

The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]:

Fiber-reinforced composite sheet and integrated molding

Fiber-reinforced composite sheet

The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and an epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B], [C], [D], and [E]: [A] epoxy resin, [B] amine curing agent, [C] phosphorus compound, [D] curing accelerator, and [E] thermoplastic resin, wherein the resin composition has a phosphorus atom concentration of 0.2 to 15% by weight.

Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment

Composition of epoxy resin, curing agent and reactive compound

Epoxy resin compositions, epoxy resin compositions for fiber-reinforced composite materials, and fiber-reinforced composite materials comprising the same

Disclosed is a microcapsule-type curing agent comprising (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin dissolvable to the thermosetting resin by heating. The microcapsule-type curing agent is formed as a particle-like material in which the component (A) is coated with a layer whose main constituent is the component (B) and the mean particle diameter of which is in the range of 0.1 to 20 .mu.m. By using the microcapsule-type curing agent, a thermosetting resin composition and a prepreg which are good in storage stability at a room temperature and excellent in thermal resistance of a cured product made therefrom can be obtained. Further, a fiber reinforced composite material obtained using this thermosetting resin composition is excellent in curing uniformity and thermal resistance.

Microcapsule-type curing agent, method for producing the same,

A prepreg precursor including a carbon fiber woven fabric having applied to the fabric between about 0.5 to about 10 wt % of a stabilizer material for stabilizing the structural form of the fabric. Prepregs can then be produced using the woven fabric. Undesired settlement of matrix resin from the surface of the woven fabric is thus prevented. Hence, compared with a prepreg prepared using conventional woven fabric, a prepreg prepared by using the woven fabric of the invention can hold its tackiness for a long time and can be used to produce a fiber reinforced composite material excellent in smoothness without being devoid of surface resin.

Woven carbon fiber fabric

Disclosed is a microcapsule curing agent including (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin. The microcapsule curing agent is formed as a particle-like material in which component (A) is coated with a layer whose main constituent is component (B) and the mean particle diameter of which is in the range of 0.1 to 20 .mu.m. By using the microcapsule curing agent, a thermosetting resin composition and a prepreg which exhibit good storage stability at room temperature and are excellent in thermal resistance for cured products made therefrom can be obtained. A fiber reinforced composite material obtained using the thermosetting resin composition is excellent in curing uniformity and thermal resistance.

Growing community of inventors

Ehime, Japan

Ryuji Sawaoka