Colin Electronics Co., Ltd.

Ryuji Nakashima

Chikao Harada

Norio Kawamura

Masanobu Yasui

Tatsushi Kondo

Toshimasa Yamazaki

Arihiro Takahashi

A contact pressure sensor including a semiconductor chip having opposite surfaces, at least one pressure sensing element provided in one of the opposite surfaces of the chip, a spacer member supporting the other surface of the chip, a substrate having a surface to which the spacer member is fixed, the one surface of the chip being pressed against an object which produces a pressure, so that the at least one sensing element detects the pressure produced by the object, a first connection terminal provided in the one surface of the chip, a second connection terminal provided in the surface of the substrate, and a flexible flat cable connecting between the first and second connection terminals, the flexible flat cable being bent into two portions one of which extends along a side surface of the spacer member and the other of which extends along the surface of the substrate. The contact pressure sensor may further comprise a light-shading layer covering the one surface of the chip in which the at least one pressure sensing element is provided.

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Seto, Japan

Ryuji Nakashima