Denka Company Limited

Ryuji Koga

Saori Inoue

Toshitaka Yamagata

Yoshitaka Minakata

Ryo Yoshimatu

Hideki Hirotsuru

Ryo Yoshimatsu

Eri Sasaki

Ryoh Yoshimatu

A ceramic-metal temporary bonding body to inhibit breakage and degradation of a ceramic resin composite having low strength includes: a ceramic resin composite in which a non-oxide ceramic sintered body is impregnated with a thermosetting resin composition having cyanate groups in such a manner that a degree of cure calculated by differential scanning calorimetry is 5.0% or more and 70% or less; and a metal plate temporarily bonded to at least one surface of the ceramic resin composite. A shear bond strength between the ceramic resin composite and the metal plate is 0.1 MPa or more and 1.0 MPa or less.

Temporary bonding body of ceramic resin composite and metal plate, method for producing same, object to be transported including the temporary bonding body, and method for transporting same

A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.

Nitride ceramic resin composite body

A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.

Thermal conductive member and heat dissipation structure including the same

Provided is a heat dissipation structure for an electric circuit device excellent in mass-productivity and heat radiation performance. A heat dissipation structure for an electric circuit device, the structure including a layered structure comprising: a heatsink exposed on the electric circuit device; a thermal conductive member; and a cooler, wherein the thermal conductive member is a ceramic-resin composite in which a resin composition is impregnated in a ceramic sintered body, the ceramic sintered body comprising ceramic primary particles integrated into a three-dimensional structure, and wherein the thermal conductive member is arranged such that the thermal conductive member directly contacts with at least one of the heatsink and the cooler.

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Omuta, Japan

Ryuji Koga