Ngk Spark Plug Company, Limited

Ryuji Imai

Toshikatsu Takada

Rokuro Kanbe

Masao Kuroda

Rokuro Kambe

Toshiya Asano

Susumu Wakamatsu

Sotaro Tsukamoto

In a wired base plate for an electronic part, an infinite number of metallic posts made of copper are provided to a lid joining section of a plural wire layer portion, which section includes a lid joining surface area to which a lid is joined. The metallic posts supports a pressure applied thereto from a lid at the time of mounting of the wired base plate on a circuit board and prevent the plural wire layer portion having a plurality of conductor wire layers and a plurality of resinous insulation layers, from being deformed by compression. A package for an electronic part having such a wired base plate is also provided.

Wired base plate and package for electronic parts

An integrated circuit package comprises a power supply conductor film having a potential and conductor columns insulated from and passed through the power supply conductor film. A power supply conductor column comprises one of the conductor columns connected to a power supply having a potential different from the power supply conductor film. The other conductor columns are signal conductor columns for exchanging signals with mounted integrated circuits. An insulation space between the power supply conductor film and the power supply conductor column is greater than an insulation space between the power supply conductor film and a signal conductor column. Thereby, a probability of short-circuit occurrence in the power supply conductor film across the power supply conductor column is lowered.

Integrated circuit package

In a multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, the grounding conductor wiring is in the form of a grid and an open area ratio Rx [%]of the grid and a line width ratio Ry=Wg/Ws have a relationship expressed by Ry, .ltoreq.25.98.times.Rx.sup.-0.3871 -4.370 where Wg is the line width of the grounding conductor wiring, Sg is the width of an opening of the grid, Ws is the line width of the signal circuit wiring, and Rx={Sg/(Wg+Sg)}.sup.2 .times.100.

Multi-layer wiring board

An integrated circuit package in which three conductor columns for connecting an insulating substrate and an integrated circuit are connected in parallel for use as I/O vias. Thereby, the conductor columns in a multilayer wiring portion between an integrated circuit and an insulating substrate is prevented from disconnecting.

Integrated circuit package having a multilayered wiring portion formed

A terminal for an electric circuit device, comprises a copper core, a gold (Au) layer provided over the copper core, and a nickel (Ni) layer having the thickness of 1.5 .mu.m or less, provided under the gold (Au) layer. In another embodiment, the core is made of an alloy containing (Ni) and covered by a metallized surface layer made of copper.

Input/output terminal for electronic circuit device

An object of the present invention is to match impedance of each portion of whole lines of a signal wiring with the integrated circuit mounted on the package. All ground planes are deleted within a region vertically under/above a connection pad provided on the top- or bottom-surface of a polyimide multilayer part, whereby no capacitance is generated between the connection pad and the ground planes, so that the impedance of the signal wiring within the region right under/above the connection pad is prevented from being lowered.

Integrated circuit package in which impendance between signal pads and

In a method of fabricating a multilayered interconnection for integrated circuit package, a coating of a metallized conductive pattern is formed on an upper surface of the substrate. A plurality of vertical copper studs are formed on the substrate for an interconnection with the metallized conductive pattern. A polyimide slurry is provided on the surface of the substrate to cover each top surface of the conductive studs. An upper surface of the polyimide slurry is polished to expose each top surface of the copper studs. A masking film is provided on each top surface of the copper studs prior to supplying an intermediate derivative of a polyimide polymer. The masking film works to protect the intermediate derivative against an chemically reaction with the copper studs to avoid a chelate compound from being produced at the time of heating step followed; A coat of the intermediate derivative of the polyimide polymer is provided entirely on the polished surface of the polyimide slurry, and is heated to form a coating of a polyimide layer. Then the coating of the polyimide layer is partly removed to expose portions corresponding to each top surface of the copper studs. The masking film is removed by etching.

Growing community of inventors

Nagoya, Japan

Ryuji Imai