Mitsubishi Gas Chemical Company, Inc.

Ryuji Ideno

Takeshi Koyama

Takao Ota

Atsushi Okoshi

Seiji Kita

Masashi Ogiwara

Gou Higashihara

Yoshinori Onose

Masami Okuo

A curing agent for epoxy resins which comprises cyclohexanetricarboxylic acid anhydride (A) comprising trans,trans-1,2,4-cyclohexanetricarboxylic acid 1,2-anhydride expressed by formula (1) and aliphatic dicarboxylic acid anhydride (B) and an epoxy resin composition which comprises the curing agent and an epoxy resin are provided. The curing agent of the present invention can be handled easily since the curing agent is liquid at the ordinary temperature, exhibits an excellent curing property without addition of a curing accelerator and provides a cured product of an epoxy resin exhibiting excellent transmission of light and heat stability. The epoxy resin composition can be advantageously used for coating materials, adhesives, molded products, resins for encapsulating photo-semiconductors and coating fluids for protective films of color filters constituting liquid crystal display devices (LCD), solid state imaging devices (CCD) and electroluminescence (EL) devices. 

Curing agent for epoxy resins and epoxy resin compositions

The aromatic hydrocarbon resin can be used as a coating material and a resist resin for a semiconductor, and has a high carbon concentration and a low oxygen concentration. A composition for forming an underlayer film for lithography that has excellent etching resistance as an underlayer film for a multilayer resist process, an underlayer film formed with the same, and a pattern forming method using the same are disclosed. An aromatic hydrocarbon is reacted with an aromatic aldehyde in the presence of an acidic catalyst, thereby providing an aromatic hydrocarbon resin that has a high carbon concentration of from 90 to 99.9% by mass and a low oxygen concentration of from 0 to 5% by mass. A composition for forming an underlayer film for lithography contains the resin and an organic solvent, an underlayer film is formed with the same, and a pattern forming method uses the same.

Aromatic hydrocarbon resin and composition for forming underlayer film for lithography

A process for producing a hollow shaped article having an inner surface which is brought into contact with fuels. The hollow shaped article is produced by bonding two or more constitutional members at peripheral edges thereof into an integral body. At least one of the constitutional members is produced by applying a fuel barrier coating composition to one or both surfaces of a thermoplastic resin sheet to form a sheet having a fuel barrier layer, and forming the sheet into the constitutional member by a pressure forming, a vacuum forming or a pressure/vacuum forming.

Process of producing hollow shaped articles

The cyclohexanetricarboxylic monoester of the present invention is represented by the following formula 1: wherein R is as defined in the specification. The cyclohexanetricarboxylic monoester is useful particularly as the curing agent for epoxy-containing compounds. A heat-curable resin composition comprising the cyclohexanetricarboxylic monoester and an epoxy-containing compound exhibits an excellent curability without using a curing accelerator and provides a colorless transparent cured product which is little discolored even under a long-term exposure to high-temperature conditions. Such a heat-curable resin composition is suitable as sealing materials for photoelectric transducers such as blue LED and white LED, shaped articles, coating materials, adhesives, etc.

Cyclohexanetricarboxylic monoester and its use

The heat-curable resin composition of the present invention comprises an epoxy-containing resin and a curing agent, wherein the curing agent is cyclohexanetricarboxylic acid and/or an anhydride thereof. The heat-curable resin composition exhibits an excellent curability without using an curing accelerator and provides a colorless transparent cured product which is little discolored under high-temperature conditions and irradiation conditions of high-energy light. The heat-curable resin composition is suitable for producing coating compositions, adhesives, shaped articles, protective films for color filters and sealing materials for photosemiconductors such as blue LED and white LED.

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Kanagawa, Japan

Ryuji Ideno