Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Ryuji Hamada

Akira Kameda

Yoshihiro Mimura

Shingo Yamada

Atsushi Katayama

While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.

Component mounting method

Aims to provide an inspection apparatus and an inspection method for detecting an amount of misalignment of a component mounted on a panel through an ACF. The inspection apparatus detects an amount of misalignment, from a predetermined mounting position, of a component mounted on a panel's top surface through an AFC, and includes: a visible light illuminator () which illuminates with visible light a panel recognition mark formed on the panel's top surface; an infrared light illuminator which is provided on a side of the component's bottom surface not adhered to the panel and illuminates with infrared light a component recognition mark formed on the component's top surface; a visible light camera () which is provided on a bottom surface side of the panel which is opposite to a side of the panel on which the component is mounted, and which captures an image of the panel recognition mark illuminated with the visible light; an infrared camera () which is provided on a side of a bottom surface of the component not adhered to the panel, and which captures an image of the component recognition mark illuminated with the infrared light; and an amount-of-misalignment calculation unit which calculates an amount of misalignment from a predetermined positional relationship between the panel recognition mark and the component recognition mark based on the captured images of the panel recognition mark and the component recognition mark.

Inspection apparatus and inspection method

An inspection apparatus and method for precisely detect an amount of misalignment of a component mounted on a panel through an adhesive which contains conductive particles. The inspection apparatus detects an amount of misalignment, from a predetermined mounting position, of a component mounted on a surface of a panel through an ACF, and includes: a visible light camera which captures an image of a panel recognition mark formed on the panel and a component recognition mark formed on the component; an obtaining unit which obtains, from the image captured by the camera, positions of feature points of the respective recognition marks; and a calculation unit which calculates an amount of misalignment of the feature point of the component recognition mark in the image captured by the camera from a predetermined position that is determined using the position of the feature point of the panel recognition mark as a reference.

A panel is mounted on the stage while the one end electrode of the FPC (flexible board) is mounted on the mounting part of one surface of the panel and the other surface of the panel is facing upward. A mounting method includes bending the other end side of the flexible board, after holding the other end portion including the other end electrode, which is positionally adjusted based on the position recognition result of the mounting portion the press tool recognizing the position of the other end electrode, matching the positions of the mounting portion and the other end electrode by relative positional adjusting, and mounting the other end electrode on the mounting portion by temporarily pressing the other end electrode on the mounting portion.

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Osaka, Japan

Ryuji Hamada