Resonac Corporation

Showa Denko Materials Co., Ltd.

Ryuji Akebi

Takao Tanigawa

Minoru Kakitani

Chihiro Hayashi

Yoshinori Ejiri

Motoki Yonekura

Kohsuke Urashima

Takaaki Nohdoh

Shuji Gozu

Akira Horie

Provided are a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer other than the above component (B), wherein the component (B) is one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups; and a prepreg, a resin film, a laminated board, a printed wiring board and a semiconductor package, each using the maleimide resin composition.

Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package

The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.

Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package

Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20&#xb0; C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20&#xb0; C. of 0.5 Pa or more and less than 200 Pa.

Composition containing organic solvents with different vapor pressures, conductor made from composition, method for manufacturing conductor, and structure comprising conductor

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Tokyo, Japan

Ryuji Akebi