Toray Industries, Inc.

Ryuichiro Taniguchi

Mitsuhito Suwa

Masao Tomikawa

Tomoyuki Yuba

Hiroko Mitsui

Using a photosensitive resin composition comprising a polyimide (a) having, at the end of the main chain, at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, an unsaturated bond-containing polymerizable compound (b1) represented by the general formula (1), and a photopolymerization initiator (c), it is possible to conduct alkaline development and to form a polyimide film having excellent heat resistance, strength and elongation. 

Photosensitive resin composition

This invention relates to a positive photosensitive resin composition allowing development with an alkaline aqueous solution and excellent in resolution, photosensitivity and pattern form even if the film formed from the resin is thick. Furthermore, this invention relates to a photosensitive resin composition comprising (a) a polymer having one or more phenolic hydroxyl groups, (b) a compound having a phenolic hydroxyl group and containing only one group selected from a methylol group and alkoxymethyl group, and (c) a photo acid generator.

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Kyoto, Japan

Ryuichiro Taniguchi