Sumitomo Electric Toyama Co., Ltd.

Ryuichi Yoshikawa

Hitoshi Tsuchida

A plating processing apparatus in which a plating object is immersed in a plating solution to form a plating layer on a surface of the plating object. A plating tank contains the plating solution, and a power supply roller is rotated while supplying electric power to the plating object, and conveys the plating object to be immersed into the plating solution contained in the plating tank and then moved to the outside of the plating solution. An anode case is disposed inside the plating tank and held in electrical contact with the plating solution contained in the plating tank, and a control panel controls electric power supplied to the power supply roller and the anode case. A first busbar electrically connects the power supply roller and the control panel, and a second busbar electrically connects the anode case and the control panel.

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Imizu, Japan

Ryuichi Yoshikawa