Tdk Corporation

Mitsumi Electric Company Ltd.

Ryuichi Wada

Takashi Suzuki

Yukio Takahashi

Yusuke Nagai

Kouichi Kakuda

Shinichi Kondo

Yukari Akita

Takahiro Sato

Kunihiko Kawasaki

Yuya Ishima

Takuya Aoki

Kazuhiro Ebina

Hiroyuki Tanoue

Tatsuro Suzuki

Hiroshi Momoi

Akinori Ohi

Asuka Murai

Hiroki Choto

Keito Yasuda

Shinichi Sato

Takashi Kudo

Seiichi Nakagawa

Makoto Morita

Takashi Inagaki

Masahiro Endo

Kensaku Asakura

Takeshi Shibayama

Raitarou Masaoka

Kyohei Tonoyama

Yu Sakurai

Hideyuki Itoh

Makoto Kitazume

Shou Kawadahara

Atsuhito Matsukawa

Takayuki Otsuka

Kaori Sasaki

Toshiki Komiyama

Takahiro Satoh

Nami Enomoto

Fujio Furukawa

A soft magnetic metal powder or the like from which a soft magnetic metal fired body can be provided has a high magnetic permeability μ and a specific resistance ρ and is contained in a coil-type electronic component having sufficiently high inductance L and Q value and unlikely to be plating-extended and short-circuited. A soft magnetic metal powder contains soft magnetic metal particles containing at least Fe and Ni. Said soft magnetic metal powder further contains P, Si, Cr and/or M. M is at least one selected from among B, Co, Mn, Ti, Zr, Hf, Nb, Ta, Mo, Mg, Ca, Sr, Ba, Zn, Al, and rare earth elements. The content of each element is within a predetermined range.

Soft magnetic alloy powder, soft magnetic sintered body, and coil-type electronic component

A multilayer coil component includes: an element body containing a plurality of metal magnetic particles; a coil disposed in the element body; and an external electrode disposed on a surface of the element body and electrically connected to the coil. At least a part of a void part between the metal magnetic particles in the element body is filled with a first resin, the external electrode has a resin electrode containing a second resin and a conductor powder dispersed in the second resin, and the second resin connected from the resin electrode extends into the element body.

Multilayer coil component

A multilayer coil device includes an element formed by laminating a coil conductor and a magnetic element body. The magnetic element body includes soft magnetic particles and an epoxy resin. The soft magnetic particles include soft magnetic metal particles. The epoxy resin has an epoxy value of 150 or less. The epoxy resin is filled in gap spaces between the soft magnetic particles.

Multilayer coil device and method of manufacturing the same

In a multilayer coil component, a part filled with a resin and a void part not filled with the resin exist between a plurality of metal magnetic particles in an element body, one main surface of the element body is a mounting surface with respect to an external electronic component, and the edge of an external electrode is positioned on the mounting surface. In the element body, a high void region where the porosity caused by the void part is higher than the porosity of the other part in the element body extends from the edge of the external electrode on the mounting surface toward an end surface of the element body.

A composite magnetic body includes soft magnetic metal particles and non-magnetic ceramic particles each having a particle size (D50) smaller than that of the soft magnetic metal particles.

Composite magnetic body and electronic component

A ferrite composition includes a main component and an accessory component. The main component includes 43.0 to 51.0 mol % of iron oxide in terms of FeO, 5.0 to 15.0 mol % of copper oxide in terms of CuO, 1.0 to 24.9 mol % of zinc oxide in terms of ZnO, and a remaining part of nickel oxide. The accessory component includes 0.2 to 3.0 pts. wt. of silicon compound in terms of SiO, 3.0 to 8.0 pts. wt. of cobalt compound in terms of CoO(excluding 3.0 pts. wt.), and 0.2 to 8.0 pts. wt. of bismuth compound in terms of BiOwith respect to 100 pts. wt. of the main component.

Ferrite composition, ferrite sintered body, electronic device, and chip coil

A ferrite composition composed of a main component including 26 to 46 mol % of an iron oxide in terms of FeO, 4 to 14 mol % of a copper oxide in terms of CuO, 0 to 26 mol % of a zinc oxide in terms of ZnO, and a residue of 40.0 mol % or more of a nickel oxide in terms of NiO. The ferrite composition, with respect to 100 parts by weight of the main component, is also composed of a subcomponent including 0.8 to 10.0 parts by weight of a silicon compound in terms of SiO, 1.0 to 15.0 parts by weight of a cobalt compound in terms of CoO, and 0.7 to 30.0 parts by weight of a bismuth compound in terms of BiO. A value of the cobalt compound content in terms of CoOdivided by the silicon compound content in terms of SiOis 0.4 to 5.5.

Ferrite composition and electronic component

Provided is a ferrite composition composed of: a main component including 23.0 to 47.0 mole % of Fe compound in terms of FeO, 3.0 to 16.0 mole % of Cu compound in terms of CuO, 4.0 to 39.0 mole % of Zn compound in terms of ZnO, 1.5 to 13.0 mole % of Si compound in terms of SiO, and a residue of Ni compound; and a subcomponent including, with respect to 100 parts by weight of the main component, 0.1 to 8.0 parts by weight of Co compound in terms of CoOand 0.25 to 5.00 parts by weight of Bi compound in terms of BiO.

A ferrite composition comprises a main component and a sub component. The main component is comprised of 25.0 to 49.8 mol % iron oxide in terms of FeO, 5.0 to 14.0 mol % copper oxide in terms of CuO, 0 to 40.0 mol % zinc oxide in terms of ZnO, and a remaining part of nickel oxide. The sub component includes 0.2 to 5.0 wt % silicon oxide in terms of SiO, 0.10 to 3.00 wt % bismuth oxide in terms of BiO, and 0.10 to 3.00 wt % cobalt oxide in terms of CoO, with respect to the main component.

A ferrite composition comprises a main component and a sub component. The main component is comprised of 40.0 to 49.8 mol % iron oxide in terms of FeO, 5.0 to 14.0 mol % copper oxide in terms of CuO, 0 to 32.0 mol % zinc oxide in terms of ZnO, and a remaining part of nickel oxide. The sub component includes 0.5 to 4.0 wt % tin oxide in terms of SnO, 0.10 to 1.00 wt % bismuth oxide in terms of BiO, and 0.21 to 3.00 wt % cobalt oxide in terms of CoO, with respect to the main component.

An electronic component module includes a double-sided mounting board having a front surface and a back surface; components mounted on the front surface and the back surface of the double-sided mounting board; an insulating resin sealing the components mounted on the front surface and the back surface; and a lead frame bonded to the back surface of the double-sided mounting board. The back surface of the double-sided mounting board is sealed with the insulating resin such that the lead frame is not covered by the insulating resin, and the thickness of the insulating resin sealing the components mounted on the back surface of the double-sided mounting board is less than or equal to the thickness of the lead frame.

Electronic component module including a lead frame and an insulating resin having a thickness less than or equal to a thickness of the lead frame and method for producing same

A ferrite composition includes a main component having 46.0 to 49.8 mol % of an iron oxide in terms of FeO, 5.0 to 14.0 mol % of a copper oxide in terms of CuO and 8.0 to 32.0 mol % of a zinc oxide in terms of ZnO, and a remainder of the main component is composed of a nickel oxide; and as subcomponents, with respect to 100 wt % of the main component, 0.5 to 6.0 wt % of a silicon oxide in terms of SiOand 0.01 to 2.0 wt % of a boron oxide in terms of BO. Further, as a subcomponent, 0.01 to 0.17 wt % of potassium oxide in terms of KO or 0.3 to 2.0 wt % of tin oxide in terms of SnOmay be included.

An NiCuZn-base ferrite of the invention comprises as main components an iron oxide in an amount of 45.0 to 49.0 mol % on FeObasis, an copper oxide in an amount of 5.0 to 14.0 mol % on CuO basis and a zinc oxide in an amount of 1.0 to 32.0 mol % on ZnO basis with a nickel oxide accounting for the rest mol % on NiO basis. With respect to the main components, a bismuth oxide is contained in an amount of 0.25 exclusive to 0.40% by weight on BiObasis, and a tin oxide is contained in an amount of 1.00 to 2.50% by weight on SnObasis. The invention ensures a leap upward in direct-current bias characteristics.

NiCuZn-base ferrites and electronic parts using the same

A ferrite material of the present invention is configured such that 0.05 to 1.0 wt % of bismuth oxide in terms of BiO, 0.5 to 3.0 wt % of tin oxide in terms of SnO, and 30 to 5000 wt ppm of chromium oxide in terms of CrOare added to a predetermined main component mixture composition. Therefore, it is possible to achieve an improvement in DC bias characteristics, an improvement in temperature characteristics of initial magnetic permeability, and an improvement in resistivity and further achieve an improvement in burned body strength, particularly in burned body flexural strength (bending strength).

Growing community of inventors

Tokyo, Japan

Ryuichi Wada