Denso Corporation

Ryuichi Onoda

Koji Kondo

Toshikazu Harada

Yoshitaro Yazaki

Tomohiro Yokochi

Yasutaka Kamiya

Koichiro Sato

Hideyuki Suzuki

Gentaro Masuda

Tetsuaki Kamiya

According to the present invention, between the mold-clamping process Sin which the moldis closed and the injection-pressure increase (solidifying) process S, the gate-melting process for heating the hot runnerto melt the plug (metallic material) of the gate, the mold-lubricant coating process for spraying the lubricant onto the wall surface of the cavity, and the material-metering process are simultaneously carried out in parallel to each other. Thus, the molding cycle time can be reduced to a great extent.

Metal molding method and apparatus

Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.

Manufacturing method of multilayer substrate

Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method

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Kariya, Japan

Ryuichi Onoda