Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Ryuichi Nagaoka

Atsushi Inoue

Hirotsugu Fusayasu

Makoto Iyoda

Masato Tobinaga

Masafumi Kumoi

Yoshio Nishizawa

Hisanori Sasaki

Yasuhiro Miyamoto

Tomonori Mizutani

An imaging device includes: an imaging sensor; a main circuit substrateincludes a first ground conductor; an imaging sensor cablethat includes a second ground conductor, has the imaging sensormounted thereon, and is connected to the main circuit substrate; a metal platethat is disposed between the main circuit substrateand an area of the imaging sensor cablewhere the imaging sensoris mounted thereon, and that is electrically connected to the second ground conductor; and a ground connection conductorthat electrically connects between the first ground conductor and the metal plate. The ground connection conductoris disposed in an area where the imaging sensorand the imaging sensor cableoverlap each other or in an area where the imaging sensorand the main circuit substrateoverlap each other.

Imaging device

An imaging device includes: an imaging sensorconfigured to capture an optical image of an object and generate image data; a main circuit substrateconfigured to perform signal processing of the image data generated by the imaging sensor; a mounting componentconfigured to mount the imaging sensor; a metal platedisposed between the mounting componentand the main circuit substrate; and an electrically-conductive sectionconfigured to electrically connect between a ground conductor of the main circuit substrateand the metal plate. The electrically-conductive sectionis positioned in an area where the metal plateand the imaging sensoroverlap each other in the case of a back surface of the metal platebeing viewed in a direction orthogonal thereto.

An imaging deviceincludes: an imaging elementa main circuit substratea mounting componentmounting the imaging elementa metal platedisposed between the mounting componentand the main circuit substratea mountsupporting the metal plateby connection sectionsbeing fixed at at least three fixing points; elastic componentsurging the connection sectionsat each fixing point of the mountand an electrically-conductive componentelectrically connecting between a ground conductor of the main circuit substrateand the metal plateThe electrically-conductive componentis disposed such that a connection point with the metal plateis positioned in a area formed by the at least three fixing points being sequentially connected in the case of a back surface of the metal platebeing viewed in a direction orthogonal thereto.

An imaging device to which a support can be attached includes a support attachment unit and a support body unit. The support attachment unit includes a first threaded hole configured to be attached to the support, and an exposure face formed around the entrance of the first threaded hole. The support body unit includes a housing having an opening configured to expose the exposure face and an outer surface formed around the opening, and movably supports the support attachment unit. The support attachment unit is disposed at a first position when the support is not attached, and is disposed at a second position when the support is attached. The exposure face is disposed more to the inside of the housing than the outer surface when the support attachment unit is disposed at the first position.

A camera body includes a body mount to which the lens unit can be mounted, a metal main frame supporting the body mount, an imaging element configured to convert an optical image of the subject into image data, an intermediate part disposed along a thermal conduction path formed between the main frame and the imaging element, and a metal heat radiating member connected to the intermediate part.

Camera body and imaging device equipped with same

A camera body includes a body mount, an imaging element, an imaging element circuit board, a main circuit board, and a metal heat radiating plate. The body mount allows the lens unit to be mounted. The imaging element is disposed on the opposite side of the body mount from the side where the lens unit is mounted, and converts an optical image of the subject into image data. The imaging element circuit board is electrically connected to the imaging element and controls the imaging element. The main circuit board is disposed on the opposite side of the imaging element from the body mount, and includes a camera controller. The heat radiating plate is disposed between the imaging element and the main circuit board.

Growing community of inventors

Osaka, Japan

Ryuichi Nagaoka