Sumitomo Bakelite Company Limited

Ryuichi Murayama

Yasuo Shimobe

Hikaru Okubo

Nobuki Tanaka

Kazuto Onami

Kouji Makihara

Koji Makihara

Tomohiro Kagimoto

Takashi Kawana

Keiji Mitote

Naoya Kanamori

Keiichiro Saitoh

A paste-like adhesive composition of the present invention contains metal particles (A) and a thermally polymerizable compound (B), in which the metal particles (A) form a particle coupling structure by causing sintering through a thermal treatment; when dynamic viscoelasticity of the composition is measured under a condition of a measurement frequency of 1 Hz, within a temperature region of 140&#xb0; C. to 180&#xb0; C., the composition has a temperature width of equal to or larger than 10&#xb0; C. in which a shear modulus of elasticity is equal to or higher than 5,000 Pa and equal to or lower than 100,000 Pa; and an acetone insoluble fraction of a sample, which is obtained by removing the metal particles (A) and then heating the composition under conditions of 180&#xb0; C. and 2 hours, is equal to or lower than 5% by weight.

Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsink

According to the present invention, a semiconductor having excellent yield is provided. The semiconductor device () of the present invention includes:

Semiconductor device

A resin composition of the present invention includes a maleimide derivative (A) represented by a general formula (1) and a bis-maleimide compound (B) represented by a general formula (2). In the general formula (1), R1 represents a straight chain or branched alkylene group having 1 or more carbon atoms, R2 represents a straight chain or branched alkyl group having 5 or more carbon atoms, and the sum of carbon atoms of R1 and R2 is 10 or less. In the general formula (2), X1 represents &#x2014;O&#x2014;, &#x2014;COO&#x2014;, or &#x2014;OCOO&#x2014;, R3 represents a straight chain or branched alkylene group having 1 to 5 carbon atoms, R4 represents a straight chain or branched alkylene group having 3 to 6 carbon atoms, and m is an integer of 1 or more and 50 or less. 

Resin composition and semiconductor device produced using resin composition

According to the invention, a liquid resin composition which has favorable wet spreadability after mounting of a chip and exhibits excellent solder cracking resistance even in a high-temperature solder reflow process at about 260&#xb0; C., i.e., even when being used in lead-free solder, and a semiconductor package using the liquid resin composition are provided. In the liquid resin composition of the invention, an acrylic copolymer having a radical polymerizable functional group contains alkyl(meth)acrylate as a constituent monomer having a linear or branched alkyl group having 6 to 9 carbon atoms in an amount of 10 wt % to 40 wt % of the entire constituent monomers.

Liquid resin composition and semiconductor device

The present invention provides a die-attaching paste superior in solder cracking resistance, used for bonding of semiconductor chips. The present invention lies in a die-attaching paste comprising as essential components:

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Tokyo, Japan

Ryuichi Murayama