Dic Corporation

Ryuichi Matsuoka

Kazunori Tanaka

Jun Shirakami

Mitsuru Kitada

Sadamu Nagahama

Hiroyoshi Kannari

Masaya Masumoto

Lichen Yang

Katsuya Maeyama

Chisato Kuriyama

Shoko Nishida

Provided is a cured product having excellent heat resistance and dielectric properties (low dielectric properties) by using a curable resin characterized by having an indane skeleton. Specifically, provided are a curable resin having an indane skeleton represented by the following formula, a resin composition containing the same, and a cured product thereof. X is a (meth)acryloyl group; Ra and Rb are each an alkyl group, an aryl group, an aralkyl group, or a cycloalkyl group with a carbon atom number of 1 to 12; j is an integer of 1 to 3; k and l are each an integer of 0 to 4; n is an average number of repeating units, being 0.5 to 20; and m is an integer of 0 to 2.

Curable resin, curable resin composition, and cured product

A polyarylene ether ketone resin has a repeating unit (1-1) represented by general formula (1-1) below and a repeating unit (2-1) represented by general formula (2-1) below. In the formulae, R is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, Ar1 and Ar2 are each a divalent organic group (3-1) represented by general formula (3-1) below, and n is 0 or 1.

Polyarylene ether ketone resin and production method therefor, and molded article

An object is to provide a cured product and the like with excellent fire retardancy, heat resistance, and dielectric properties by using a curable resin having a specific structure and a curable resin composition containing the curable resin, a radical polymerization initiator, and a fire retardant. Specifically provided are a curable resin represented by General Formula (1) and a curable resin composition containing the curable resin, a radical polymerization initiator (B), and a fire retardant (C):

Provided is a poly(arylene ether ketone) resin which inhibits reactions such as molecular weight extension and crosslinking in a high-temperature molten state and which is excellent in melt viscosity stability and molding processability. The poly(arylene ether ketone) resin contains an alkylsulfonyl group represented by general formula (1). In the formula, R is an alkyl group containing one to four carbon atoms.

Poly(arylene ether ketone) resin, method for producing the same, and molded article

An object to be achieved by the present invention is to provide a binder for an ink-jet printing ink, the binder being capable of forming a printed image having excellent durability such as rubfastness and alkali resistance without impairing good ejection stability, storage stability, etc. of an ink, and an ink-jet printing ink containing the binder. The present invention relates to a binder for an ink-jet printing ink, the binder containing an aqueous medium (D); and a polyurethane (C) obtained by reacting a polyol (A) containing a vinyl polymer (a1) having two hydroxyl groups at one end and at least one polyol (a2) selected from the group consisting of polyether polyols, polyester polyols, polyester ether polyols, and polycarbonate polyols with a polyisocyanate (B), the polyurethane (C) having a structure derived from the vinyl polymer (a1) in a side chain thereof and being dispersed in the aqueous medium (D), and printed matter.

Binder for inkjet printing ink, inkjet printing ink containing the binder, and printed product

An object of the present invention is to provide a method for producing a binder for inks and for use in producing an inkjet printing ink that has both good ink dischargeability and blend stability. A method for producing a binder for inkjet printing inks, the binder containing a hydrophilic-group-containing urethane resin (A), an acetylene compound (B), and an aqueous medium (C), includes step (1) of allowing Ga polyol (a1) containing a hydrophilic-group-containing polyol to react with a polyisocyanate (a2) in an organic solvent or in the absence of a solvent and feeding the organic solvent as needed to prepare an organic solvent solution [I], step (2) of mixing the organic solvent solution [I] with the acetylene compound (B) and the aqueous medium (C) to prepare a mixture [II], and step (3) of removing the organic solvent contained in the mixture [II].

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Osaka, Japan

Ryuichi Matsuoka