Taiyo Yuden Co., Ltd.

Lan Technical Service Co., Ltd.

Other

Bondtech Co., Ltd.

Tadatomo Suga

Ryuichi Kondou

Takayuki Arai

Kenji Otake

Shinsuke Takeoka

Kazuhiko Oyama

Akiko Yamaguchi

Akira Yamauchi

Yoshiie Matsumoto

Kentaro Nakamura

Kenichi Ota

One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The three or more magnetic alloy particles have an average particle diameter of 4 &#x3bc;m or smaller. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.

Laminated inductor

[Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.

Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly

One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer has a thickness of 4 to 19 &#x3bc;m, and includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.

Various aspects of the present invention provide a transfer method for peeling off an MIM structure (comprising lower electrode/dielectric layer/upper electrodes) film formed on a supporting substrate and then transferring onto a transfer substrate with sufficiently uniform and low damage. Various aspects of the present invention also provide a thin film element provided with one or more thin film components which are transferred onto a substrate by using said method.

Method of transferring thin film components and circuit board having the same

A micro-cantilever of a simple structure and capable of obtaining a larger displacement at a low voltage including a plate-like piezoelectric substrate having electrode films as an upper electrode and a lower electrode formed on both surfaces thereof, a plate-like resilient member in close contact with the piezoelectric substrate on the side of the lower electrode and a support for supporting a driving member in a cantilever manner, in which a thin-walled portion is formed to the vicinity of a base portion of the driving member supported by the support.

Growing community of inventors

Tokyo, Japan

Ryuichi Kondou