Nitto-denko Corporation

Ryuichi Kimura

Hiroyuki Katayama

Kazuhiro Fuke

Hirokazu Matsuda

Yuki Ebe

Hidenori Onishi

Takashi Kondo

Naohide Takamoto

Munehisa Mitani

It is an object of the present invention to provide a film for semiconductor back surface having reworkability, and an application of the film. A film for semiconductor back surface has: an adhering strength at 70&#xb0; C. of 7 N/10 mm or less to a wafer before the film is thermally cured; and a rupture elongation at 25&#xb0; C. of 700% or less. The film for semiconductor back surface preferably has a degree of swelling due to ethanol of 1% by weight or more. The film for semiconductor back surface preferably contains an acrylic resin.

Film for semiconductor back surface and its use

A silicone resin sheet is formed from a resin composition containing a thermosetting silicone resin and microparticles. The complex viscosity thereof at a frequency of 10 Hz is 80 to 1000 Pa&#xb7;s and the tan &#x3b4; thereof at a frequency of 10 Hz is 0.3 to 1.6 obtained by a dynamic viscoelastic measurement at a frequency of 0.1 to 50 Hz at 30&#xb0; C.; a rate of frequency increase of 10 Hz/min; and a distortion of 1% in a shear mode.

Silicone resin sheet, cured sheet, and light emitting diode device and producing method thereof

A method for producing an encapsulating layer-covered semiconductor element includes the steps of preparing a support sheet including a hard support board; disposing a semiconductor element at one side in a thickness direction of the support sheet; disposing an encapsulating layer formed from an encapsulating resin composition containing a curable resin at the one side in the thickness direction of the support sheet so as to cover the semiconductor element; curing the encapsulating layer to encapsulate the semiconductor element by the encapsulating layer that is flexible; cutting the encapsulating layer that is flexible corresponding to the semiconductor element to produce an encapsulating layer-covered semiconductor element; and peeling the encapsulating layer-covered semiconductor element from the support sheet.

Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device

A method for producing an encapsulating layer-covered semiconductor element includes the steps of preparing a support sheet including a hard support board formed with a through hole passing through in a thickness direction and a pressure-sensitive adhesive layer laminated on a surface at one side in the thickness direction of the support board so as to cover the through hole; disposing a semiconductor element on a surface at one side in the thickness direction of the pressure-sensitive adhesive layer in opposed to the through hole in the thickness direction; covering the semiconductor element with an encapsulating layer to produce an encapsulating layer-covered semiconductor element; and inserting a pressing member into the through hole from the other side in the thickness direction to peel the encapsulating layer-covered semiconductor element from the pressure-sensitive adhesive layer.

A silicone resin composition contains a silicon-containing component including a silicon atom to which a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group is bonded and a silicon atom to which an alkenyl group is bonded. The number of moles of alkenyl group per 1 g of the silicon-containing component is 200 to 2000 &#x3bc;mol/g.

Silicone resin composition, encapsulating material, and light emitting diode device

The present invention relates to a composition for a thermosetting silicone resin including: a dual-end silanol type silicone oil; an alkenyl-containing silicon compound; an organohydrogensiloxane; a condensation catalyst; and a hydrosilylation catalyst, in which the condensation catalyst includes a tin complex compound.

Composition for thermosetting silcone resin

A silicone resin composition contains a first organopolysiloxane having, in one molecule, both at least two ethylenically unsaturated hydrocarbon groups and at least two silanol groups; a second organopolysiloxane having, in one molecule, at least two hydrosilyl groups without having an ethylenically unsaturated hydrocarbon group; a hydrosilylation catalyst; and a hydrosilylation retarder.

Silicone resin composition, silicone resin sheet, optical semiconductor element device, and producing method of silicone resin sheet

The present invention relates to a composition for thermosetting silicone resin including: (1) a dual-end silanol type silicone resin represented by formula (I) in which Rrepresents a monovalent hydrocarbon group, and n is an integer of 20 to 10,000, provided that all Rgroups may be the same or different; (2) a trialkoxysilane; and (3) a condensation catalyst. 

Composition for thermosetting silicone resin

The present invention relates to a composition for a thermosetting silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an alkenyl group-containing silicon compound; (3) an epoxy group-containing silicon compound; (4) an organohydrogensiloxane; (5) a condensation catalyst; (6) a hydrosilylation catalyst; and (7) a silica particle, in which the (7) silica particle has a 50% volume cumulative diameter of from 2 to 50 &#x3bc;m, a content of particles having a particle size of 1 &#x3bc;m or less of 15% by number or less and a content of particles having a particle size of 60 &#x3bc;m or more of 15% by number or less.

Growing community of inventors

Osaka, Japan

Ryuichi Kimura