Dainippon Screen Mfg. Co., Ltd.

Screen Holdings Co., Ltd.

Ryuichi Hayama

Kenji Fujii

Masahiro Miyagi

Yasuhiro Mizohata

Hideaki Matsubara

Tomoyuki Komura

Fuminori Asa

A discharge apparatuscomprises a feeder partwhich is provided on a flow path of a discharge material from a supply partto a nozzleand feeds the discharge material in the flow path at a predetermined flow rate from the supply parttoward the nozzleand a plurality of pressurizersprovided in parallel to each other on the flow path and each having a function of temporarily storing the discharge material in a storage space and a function of pressurizing the discharge material stored in the storage space and feeding the discharge material under pressure to the feeder part. The plurality of pressurizersoperate complementarily manner, thereby a constant pressure is applied to the discharge material fed to the feeder part

Discharge apparatus and discharge method

A plating apparatus () provided with: a plating vessel (to) having a cylindrical side wall () for containing a plating liquid; a substrate holding mechanism (to) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring () provided in the substrate holding mechanism and having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the substrate, the cathode ring having a cathode () to be brought into contact with the substrate held by the substrate holding mechanism; and a rotative driving mechanism () for rotating the substrate held by the substrate holding mechanism together with the cathode ring; wherein the plating vessel has an upper edge portion complementary in configuration to a portion of the cathode ring opposed to the plating vessel so that the lower surface of the substrate held by the substrate holding mechanism can approach the plating vessel so as to be substantially flush with the upper edge of the plating vessel without interference between the upper edge portion of the plating vessel and the cathode ring.

Plating apparatus, plating cup and cathode ring

A substrate transfer apparatus provided with a first substrate transfer mechanism having a first substrate holding hand which is movable while holding a substrate; and a second substrate transfer mechanism having a second substrate holding hand for receiving and transferring a substrate directly from and to the first substrate holding hand. The apparatus has a positioning mechanism disposed, in a moving passage of a substrate held by the first substrate holding hand, independently from the first substrate transfer mechanism, and having a positioning contact portion for regulating the movement of a substrate such that the substrate is positioned at a predetermined position on the first substrate holding hand.

Substrate transfer apparatus and substrate transfer method

Growing community of inventors

Kyoto, Japan

Ryuichi Hayama