C.i. Kasei Company, Limited

Ryuichi Edasaki

Akira Hori

Yasuhiro Matsuo

Hideyuki Murakami

Yusaku Uryu

An improvement is proposed in the method for adhesively bonding a decorative overlay film of a plastic resin to the surface of an acrylic resin board with a hot-melt adhesive, by which the overlaid acrylic resin board can be imparted with greatly improved stability of overlaying lamination as well as good machining workability of the board. The improved method comprises the steps of: (a) demoisturizing the acrylic resin board by heating at 60-90.degree. C. for at least 2 hours; (b) forming a layer of a hot-melt adhesive on at least either one of the resin board and the overlay film; (c) laminating the resin board and the overlay film with the adhesive layer therebetween to obtain a laminate by passing between a pair of laminating rollers while the surfaces to be brought into contact with each other are kept at an elevated temperature; and (d) subjecting the laminate to an aging treatment by heating at 30-60.degree. C. for at least 1 hour.

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Akashi, Japan

Ryuichi Edasaki