Hitachi, Ltd.

Ryozo Tomosaki

Atsushi Miyazaki

Katsuhiko Kikuchi

Masaaki Suzuki

The invention is intended to provide a small and highly reliable pressure sensor, which has a smaller number of components and can be produced by using a mold for resin molding in common. A sensor unit () is molded with resin and includes a semiconductor chip () for converting the change in pressure of a medium introduced through an introduction hole for measurement into an electric signal. A lead member () has one end exposed in a connector () and is electrically connected to the semiconductor chip () in the sensor unit () beforehand. Pressure is applied to the semiconductor chip () through a pipe (). An outer case () is integrally formed of synthetic resin by insert molding of the sensor unit (), the lead member () and the pipe ().

Growing community of inventors

Tokyo, Japan

Ryozo Tomosaki