Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Ryoutarou Imura

Masanori Minamio

Takahiro Fukunaga

Zyunya Tanaka

There is provided a semiconductor device that suppresses the occurrence of resin burrs and has favorable electrical connectivity and bond strength, and a manufacturing method for such semiconductor device. A resin-coated metal part is manufactured by forming an organic coating by depositing a material including functional organic molecules on a wiring lead composed of a metallic material. Each of the functional organic molecules includes a main chain, a first functional group having a metal bonding property, and a second functional group. The first functional group and the second functional group are provided at different ends of the main chain. Thereafter the functional organic molecules self-assemble by bonding of the first functional groups to metal atoms of the wiring lead. After performing the organic coating formation step, resin is adhered to a predetermined surface area of the wiring lead having the organic coating formed thereon.

Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device

A conduction path includes a first conduction path forming plate () made of a first metal and having a through hole (), and a second conduction path forming plate () made of a second metal and having a press-fit portion () press-fitted into the through hole. A wall surface of the through hole and a side surface of the press-fit portion forms an inclined bonding surface () inclined relative to a normal line of an overlap surface of the first conduction path forming plate and the second conduction path forming plate, and a bonding portion () formed by metal flow is formed in a region located in a periphery of the inclined bonding surface.

Growing community of inventors

Kyoto, Japan

Ryoutarou Imura