Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Ryouichirou Katano

Shinjiro Tsuji

Kozo Odawara

Tomotaka Nishimoto

Masayuki Ida

Takahiko Murata

Akira Yamada

Yasuhiro Okada

Keiji Fujiwara

Yuichi Takakura

Masaya Watanabe

Provided is an apparatus capable of easily splicing ACF tapes that are thin and are hard to handle. The tape splicing apparatus splices two ACF tapes () each having an ACF (), and includes: a first holding unit that holds one of the ACF tapes (); a second holding unit that holds the other one of the ACF tapes (); a positioning unit () that positions the ACF tapes () to be overlapped in a thickness direction; and a pressing unit () that presses the overlapped ACF tapes () in the thickness direction.

Tape splicing apparatus and attaching apparatus

An adhesive tape applying apparatus includes a stage on which a terminal end portion of a first tape member and a leading end portion of a second tape member are placed so as to be superimposed on each other, an ultrasonic tool in which a plurality of protruding portions are provided on its contact surface that is to be put into contact with the leading end portion or terminal end portion of the superposed tape members, an ultrasonic vibration generator for applying ultrasonic vibrations in a tape's thicknesswise direction to the ultrasonic tool, and a pressing device for making a stage-directed pressing force act on the ultrasonic tool. As a result, the terminal end portion of the in-use first tape member and the leading end portion of the second tape member rolled out from a new reel can be spliced together with a simple, low-cost construction while the possibility of occurrence of trouble in tape feed is eliminated.

Adhesive tape applying apparatus and tape splicing method

A substrate edge part cleaning apparatus judging a cleaning degree of glass substrates when cleaning edge parts of the glass substrates used for liquid crystal display. The substrate edge part cleaning apparatushaving a cleaning head wiping an edge part of a substrate for display A while moving rectilinearly, and having a cameracapturing images of the proximity of an edge of a color filter which is placed on the substrate, by moving together with the cleaning head. The cameraobtains surface status information of the substrate part which has been cleaned, and the substrate edge part cleaning apparatusfurther includes a cleaning degree judgment unitjudging a cleaning degree based on the surface status information.

Substrate edge part cleaning apparatus and substrate edge part cleaning method

A board terminal cleaning apparatus for cleaning a terminal portion by bringing a cleaning member in contact with the terminal portion of a board comprises a first support member that supports the cleaning member in a first position, a second support member that supports the cleaning member in a second position, a cleaning head that pressurizes part of the cleaning member supported between the first position and the second position by bringing the part in contact with the terminal portion of the board, a support member moving unit that moves the first support member and the second support member in the direction along the terminal portion, and a cleaning head moving unit that moves the cleaning head in the direction along the terminal portion at a second movement velocity different from the first movement velocity of the first support member and the second support member by the support member moving unit.

Apparatus and method for cleaning a board terminal

The final-bonder is equipped with a warping correction unit that is equipped in parallel with a backup stage with a distance of about 20 mm from such backup stage, and that includes accordion pads for sucking a liquid crystal panel; the backup stage that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the bonding of semiconductor components; and a pressure head that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.

Substrate processing apparatus and mounter

An adhesive sheet attaching device is provided with: a stage (); a feeder () for feeding adhesive sheet () onto the stage (); a cutter (); a pressurizer () for attaching the adhesive sheet () to a target object mounted on the stage (); a detector () for detecting a connecting portion (); and a controller. When the detector () detects the connecting portion (), the controller stops the operation of the feeder () after adhesive sheet () of an attachable length up to the connecting portion () has been attached. This makes it possible to reliably prevent adhesive sheet () containing a connecting portion () from being attached to a target object, and to effectively use the adhesive sheet up to the connecting portion (), thus making it possible to suppress resource loss.

Growing community of inventors

Osaka, Japan

Ryouichirou Katano