Hitachi, Ltd.

Renesas Technology Corp.

Ryouichi Kajiwara

Shinji Hiramitsu

Shosaku Ishihara

Satoshi Matsuyoshi

Osamu Ikeda

Koji Sasaki

Hiroi Oka

Tadaaki Kariya

Kazutoshi Itou

Hidemasa Kagii

Hiroyuki Nakamura

Pb free solder is used in die bonding. A thermal stress reduction plate is disposed between a semiconductor chip and a die pad made of a Cu alloy. The semiconductor chip and the thermal stress reduction plate are joined and the thermal stress reduction plate and the die pad are joined by a joint material of Pb free solder having Sn&#x2014;Sb&#x2014;Ag&#x2014;Cu as its main constituent elements and having a solidus temperature not lower than 270&#xb0; C. and a liquidus temperature not higher than 400&#xb0; C. Thus, die bonding can be performed using the Pb free solder without generating any chip crack.

Semiconductor apparatus and manufacturing method

The present invention provides a semiconductor device comprising a semiconductor element and a copper member which are bonded to each other by a bismuth-based (Bi-based) bonding material having its melting temperature of not less than 250&#xb0; C., wherein silver (Ag) is diffused in a region of the bonding material in the vicinity of an interface thereof to the semiconductor element with an inclination of concentration of the silver from the interface, in order to realize a manufacture of the semiconductor device without using lead (Pb) at low cost.

Semiconductor device

A semiconductor device is provided, in which buffer layers having a coefficient of linear expansion of 3&#xd7;10&#x2212;6/&#xb0; C. to 8&#xd7;10&#x2212;6/&#xb0; C. are joined to upper and lower surfaces of a silicon chip through a Pb-free solder having a thickness of not more than 0.05 mm and a melting point of not less than 250&#xb0; C. The upper surface of the upper buffer layer and the lower surface of the lower buffer layer are respectively joined to a lead and a base through Pb-free solders having a thickness of not less than 0.15 mm and a melting point of not less than 250&#xb0; C.

Growing community of inventors

Hitachi, Japan

Ryouichi Kajiwara