Sony Semiconductor Solutions Corporation

Lenovo (singapore) Pte. Ltd.

Lenovo Switzerland International Gmbh

Lenovo Limited

Ryota Watanabe

Takuroh Kamimura

Yuji Isogai

Tsutomu Imoto

Takuya Maruyama

Takuro Murase

Toshifumi Wakano

Masahiro Kitamura

Akinori Uchino

Atsunobu Nakamura

Yusuke Otake

Jun Iwasaki

Masaaki Bandoh

Hiroshi Yamazaki

Takeshi Yamazaki

Yuji Suzuki

Tatsuya Ushioda

Atsushi Ohyama

Yuichiro Seto

Junki Hashiba

Yusaku Morishige

Sangman Han

Ke Ma

Qianyi Lu

Mizuki Itoyama

Junrong Zhou

A heat radiation structure includes a vapor chamber provided along a surface of a die, a mesh interposed between the die and the vapor chamber, and a liquid metal impregnated in the mesh. In the mesh, a peripheral portion has a higher material density per unit volume than a central portion. In the mesh, the central portion may be formed of a single layer, and the peripheral portion is formed of two layers. The mesh may be a resin material.

Heat radiation structure and electronic apparatus

Provided is a light receiving device that includes a pixel array unit in which pixels each including a first tap that detects charges photoelectrically converted by a photoelectric conversion unit and a second tap that detects charges photoelectrically converted by the photoelectric conversion unit are two-dimensionally arranged in a matrix. The light receiving device further includes an on-chip lens disposed for each pixel on a light incident surface side of a substrate, and a lens isolation portion that is formed in the same layer as the on-chip lens and isolates the on-chip lenses from each other.

Light receiving device, method for manufacturing light receiving device, and distance measuring module

An electronic apparatus includes a chassis, a heat generating body provided in the chassis, an antenna configured to be provided in the chassis and be capable of receiving radio waves, an electronic part arranged to be aligned with the antenna within the chassis, and a cooling module configured to have a plate-shaped metal part and cool the heat generating body within the chassis. The metal part includes a shield wall interposed between the antenna and the electronic part.

Electronic apparatus

The present technology relates to a light receiving device, a method for manufacturing the same, and a distance measuring device capable of improving distance measurement accuracy by maintaining the balance of transfer capability between transfer transistors. A light receiving device includes a pixel including: an embedded photodiode having a charge storage layer of a second conductivity type different from a first conductivity type of a photoelectric conversion region in a region in the vicinity of a second surface on the opposite side to a first surface that is a light incident surface of a substrate; at least two transfer transistors that transfer a charge stored in the photodiode; and at least one discharge transistor that discharges a charge stored in the photodiode; in the light receiving device, the charge storage layer of the second conductivity type is placed to be, in a planar view, surrounded by gates and sidewalls of the transfer transistors, or gates and sidewalls of the transfer transistors and the discharge transistors. The present technology can be applied to, for example, a distance measuring module that measures the distance to a subject, or the like.

Light receiving device, method for manufacturing same, and distance measuring device

An information processing apparatus includes: a controller that outputs notification information based on input information; and a processor that executes system processing based on an operating system (OS) and operation of thermal control processing by control of a Basic Input Output System (BIOS) using the notification information output from the controller. The controller accepts an operation signal indicative of an operated key according to a user's operation on a keyboard; determines whether the operated key is of a specific combination of keys based on the accepted operation signal; upon making a determination that the operated key is of the specific combination of keys, outputs, to the processor, a result of the determination as the notification information; and without another key being pressed after the result of the determination is output from the controller, the processor executes the thermal control processing based on the result of the determination.

Information processing apparatus for performing thermal control based on a specific combination of keys based on accepted operation signal

An electronic apparatus includes: a heating element; and a plurality of heat pipes that is thermally connected to the heating element. Each of the heat pipes has a cross section having a rectangular shape, a heat receiving surface thermally connected to the heating element, and a side surface orthogonal to the heat receiving surface. The side surfaces of the heat pipes, which are adjacent to each other, are in surface contact with each other.

Heat pipes of an electronic apparatus and method of manufacturing the same

A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.

Heat dissipation structure, method for manufacturing heat dissipation structure, and electronic apparatus

The present technology relates to a light-receiving element and a distance-measuring module for enabling improvement of characteristics. A light-receiving element includes an on-chip lens, a wiring layer, and a semiconductor layer arranged between the on-chip lens and the wiring layer, the semiconductor layer includes a first voltage application portion to which a first voltage is applied, a second voltage application portion to which a second voltage different from the first voltage is applied, a first charge detection portion arranged around the first voltage application portion, and a second charge detection portion arranged around the second voltage application portion, and the wiring layer includes at least one ground line having a wider line width than a power supply line. The present technology can be applied to, for example, a light-receiving element that generates distance information by a ToF method.

Light-receiving element and distance-measuring module

The present technology relates to a light-receiving element and a distance-measuring module for enabling improvement of characteristics. A light-receiving element includes an on-chip lens, a wiring layer, and a semiconductor layer arranged between the on-chip lens and the wiring layer, the semiconductor layer includes a first voltage application portion to which a first voltage is applied, a second voltage application portion to which a second voltage different from the first voltage is applied, a first charge detection portion arranged near the first voltage application portion, and a second charge detection portion arranged near the second voltage application portion, and each of the first voltage application portion and the second voltage application portion is covered with an insulating film in the semiconductor layer. The present technology can be applied to, for example, a light-receiving element that generates distance information by a ToF method.

The present technology relates to a light receiving device and a distance measuring module capable of improving sensitivity. A light receiving device includes a pixel array unit in which pixels each having a first tap detecting charge photoelectrically converted by a photoelectric conversion unit and a second tap detecting charge photoelectrically converted by the photoelectric conversion unit are two-dimensionally arranged in a matrix. The first tap and the second tap each have a voltage application unit that applies a voltage, the pixel array unit has a groove portion formed by digging from a light incident surface side of a substrate to a predetermined depth, and the groove portion is arranged so as to overlap at least a part of the voltage application unit in plan view. The present technology can be applied to a distance measuring sensor or the like of the indirect ToF scheme, for example.

Light receiving device and distance measuring module

An information processing apparatus includes: a controller that outputs notification information based on input information; and a processor that functions as a system processing unit that executes system processing based on an operating system (OS) and a Basic Input Output System (BIOS) processing unit that executes control related to the performance of the system processing by control of a BIOS using the notification information output from the controller.

Information processing apparatus and control method detecting a specific key combination pressed and activating a different mode of operation

An electronic apparatus includes a bottom cover, a main board provided with a stud, a screw, a washer, and a sponge. The screw has a head portion having a diameter larger than that of an attachment hole, a male screw portion configured to be screwed into a first female screw portion, and a columnar portion having a diameter smaller than a root diameter of the male screw portion. The washer has a flange portion having a diameter larger than that of the attachment hole, a cylindrical portion having a diameter smaller than that of the attachment hole, and a second female screw portion which the male screw portion is screwable into and passable through. The head portion abuts on the bottom cover to fix the bottom cover by the male screw portion. The flange portion is between the stud and the bottom cover.

Electronic apparatus and structure

The present technology relates to a light-receiving element and a distance measurement module. A light-receiving element includes: a first voltage application unit to which a voltage is applied; a first charge detection unit that is disposed at a periphery of the first voltage application unit; a second voltage application unit to which a voltage is applied; a second charge detection unit that is disposed at a periphery of the second voltage application unit; a third voltage application unit to which a first voltage is applied; and a voltage control unit that applies a second voltage to one of the first voltage application unit and the second a voltage application unit and causes the other to be in a floating state, the second voltage being different from the first voltage. The present technology is applicable to a light-receiving element.

Light-receiving element and distance measurement module using indirect time of flight

The present technology relates to a light reception device and a distance measurement module whose characteristic can be improved. The light reception device includes an on-chip lens, a wiring layer, and a semiconductor layer arranged between the on-chip lens and the wiring layer. The semiconductor layer includes a first tap having a first voltage application portion and a first charge detection portion arranged around the first voltage application portion, and a second tap having a second voltage application portion and a second charge detection portion arranged around the second voltage application portion. Furthermore, the light reception device is configured such that a phase difference is detected using signals detected by the first tap and the second tap. The present technology can be applied, for example, to a light reception device that generates distance information, for example, by a ToF method, and so forth.

Light reception device and distance measurement module

The present technology relates to a light reception device and a distance measurement module. The light reception device includes an on-chip lens, a wiring layer, and a semiconductor layer between the on-chip lens and the wiring layer. The semiconductor layer includes a first tap to which a first voltage is applied and a first charge detection portion, and a second tap to which a second voltage different from the first voltage is applied and a second charge detection portion. The position of the on-chip lens differs depending upon an in-plane position of a pixel array section, so that an optical path length or a DC contrast of a chief ray from an object is uniform at in-plane pixels of the pixel array section. The present technology can be applied, for example, to a light reception device that generates distance information, for example, by a ToF method, and so forth.

Growing community of inventors

Kanagawa, Japan

Ryota Watanabe