A.l.m.t. Corporation

Sumitomo Electric Industries, Limited

Ryota Matsugi

Isao Iwayama

Tetsuya Kuwabara

Hideaki Morigami

Chieko Tanaka

Takahiro Nishimizu

A composite material includes: coated particles, each of which includes a carbon-based particle made of a carbon-based substance and a carbide layer that covers at least a part of the surface of the carbon-based particle; and a copper phase that binds the coated particles to each other, wherein the carbide layer is made of a carbide containing at least one element selected from the group consisting of Si, Ti, Zr and Hf, and the average particle size of the carbon-based particles is 1 μm or more and 100 μm or less.

Composite material and composite material manufacturing method

A composite material contains a metallic phase, a non-metallic phase and a specific element. At least 90 mass % of the metallic phase is composed of at least one selected from the group consisting of Ag and Cu. The non-metallic phase includes a coated core material. The coated core material includes a core material and a carbide layer that covers at least a part of a surface of the core material. The core material contains at least one carbon-containing material selected from the group consisting of diamond, graphite, carbon fibers, and silicon carbide. The carbide layer contains a carbide of at least one metal element selected from the group consisting of Ti, Cr, Ta, and V. The specific element is at least one selected from the group consisting of Y and Mg. A total content of the specific element is 0.0004 mass % to 1.3 mass %.

Composite material

A heat radiation member excellent in electrical insulation and better in thermal conduction is provided. The heat radiation member includes a substrate composed of a composite material containing diamond and a metallic phase, an insulating plate provided on at least a part of front and rear surfaces of the substrate and composed of an aluminum nitride, and a single bonding layer interposed between the substrate and the insulating plate, the heat radiation member having thermal conductivity not lower than 400 W/m·K.

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Osaka, Japan

Ryota Matsugi