Adeka Corporation

Ricoh Company, Ltd.

Toppan Printing Co., Ltd.

Ryota Chiba

Masahiro Wada

Takuya Matsuda

Masako Saito

Takuya Kanazawa

Ichiro Hiratsuka

Hiroyuki Miura

Hisashi Habashi

Takehito Tsukamoto

Junko Toda

Osamu Yoshioka

Kazushige Kitazawa

Tatsuya Sameshima

Masahide Tsuzuki

Hideyuki Yamada

Takaaki Kanbayashi

Tetsuya Toda

A liquid discharge head including: a flow path formation part in which pressure generation chambers are arranged; and a pressure generation unit configured to apply pressure to the pressure generation chambers, wherein the pressure generation unit is formed by joining a vibration unit to the flow path formation part with a resin layer, and wherein the resin layer includes a curable resin composition including (A) an epoxy resin, (B) a polythiol compound, (C) at least one adhesiveness-imparting agent selected from the group consisting of a compound represented by General Formula (1), a titanium compound represented by General Formula (2-1), and a titanium compound represented by General Formula (2-2), and (D) a curing accelerator. 

Liquid discharge head, method for producing the same, liquid discharge apparatus, and image forming apparatus

A silicon-containing curing composition including a specific amount of a silicon-containing polymer having an Mw of 300 to 100,000 obtained by hydrolysis and condensation of an organosilane mixture containing specific amounts of organosiloxanes of formulae (1-1) through (1-5); a specific amount of a prepolymer containing at least two Si&#x2014;H groups per molecule obtained by hydrosilylation between a cyclic siloxane compound of formula (2) and a compound of formula (3-1), (3-2), or (3-3); a specific amount of a linear siloxane compound containing more than one carbon-carbon double bond reactive with Si&#x2014;H or Si&#x2014;CHper molecule; specific amounts of an organic peroxide and a metal catalyst; and a specific amount of a filler. The details for the formulae (1-1) to (1-5), (2), (3-1) to (3-3) are as described in the specification.

Silicon-containing curing composition and cured product thereof

A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including RSiX, RSiX, RRSiXand RSiX, the total of RSiXand RRSiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein Ris a C2-6 alkenyl group, Ris a C1-6 alkyl group, Rand Rare each a C1-6 alkyl group, Ris a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of Rto Ris a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.

Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition

An alkali-developable photosensitive color composition containing a binder resin, a fluorine-containing copolymer, a photopolymerization initiator, a colorant, and a solvent. A photopolymerizable unsaturated compound is used as the binder resin. The photopolymerizable unsaturated compound is obtained by adding (B) an unsaturated monobasic acid to (A) a polyfunctional epoxy resin to form (C) an epoxy adduct and allowing the epoxy adduct (C) and (D) a polybasic acid anhydride to react with each other.

Alkali-developable photosensitive color composition

Growing community of inventors

Tokyo, Japan

Ryota Chiba