Murata Manufacturing Co., Ltd.

Ryota Asai

Yosuke Matsushita

Issei Yamamoto

A wiring substrate that is provided enables stray capacitance between a first electrode and a second electrode to be prevented from varying when an undulation occurs in the wiring substrate. Insulating layers are stacked. A first electrode and a second electrode are formed between the same layers at an interval. The thickness of the first electrode is more than the thickness of the second electrode. The lower main surface of the first electrode is located at a position lower than the lower main surface of the second electrode, and the upper main surface of the first electrode is located at a position higher than the upper main surface of the second electrode when seen through in a direction perpendicular to a stacking direction of the insulating layers.

Wiring substrate and electronic module

A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface.

Ceramic substrate and electronic component-embedded module

A multilayer electronic component includes an element body including a plurality of base layers stacked in a first direction, an inner conductor disposed in the element body, and a mounting terminal connected to the inner conductor. The multilayer electronic component has a mount surface positioned on a mounted side when the multilayer electronic component is mounted. The mount surface is disposed so as not to intersect an axis along the first direction. The mounting terminal is disposed on the mount surface and embedded from the mount surface into the element body.

Multilayer electronic component

A wiring board is provided with: an insulating layer; a base electrode layer layered on one primary surface of the insulating layer in predetermined regions; an insulating covering layer layered on one primary surface of the insulating layer in a state covering parts of edges of the base electrode layer; and a surface electrode layer plated on exposed portions of the base electrode layer not covered by the insulating covering layer, the thickness of covered portions of the base electrode layer covered by the insulating covering layer being less than the thickness of the exposed portions. The surface electrode layer is formed only on the exposed portions of the base electrode layer.

Growing community of inventors

Kyoto, Japan

Ryota Asai