Dexerials Corporation

Sony Chemical & Information Device Corporation

Ryota Aizaki

Jun Yamamoto

Yoshihisa Shinya

Naoki Hayashi

Misao Konishi

Kosuke Asaba

Yasuhiro Fujita

A connection body, a method for manufacturing a connection body, and a connection method which can secure conduction reliability by trapping conductive particles even when the bump size is minimized. In a connection body in which a first component having a first electrode and a second component having a second electrode are connected to each other via a filler-containing film having a filler-aligned layer in which independent fillers are aligned in a binder resin layer, the maximum effective connection portion area where the first electrode and the second electrode face each other is 4,000 μmor less and a ratio of the effective connection portion area to a particle area on the connection portion projection plane is 3 or more.

Connection body, method for manufacturing connection body, and connection method

A method for manufacturing a connection body, and a method for connecting a component, which can secure conduction reliability by trapping conductive particles even when the bump size is minimized. The method includes a disposing step of disposing a filler-containing film having a filler-aligned layer in which individual independent fillers are aligned in a binder resin layer between a first component having a first electrode and a second component having a second electrode; a temporary fixing step of pressing the first component or the second component to sandwich the filler-aligned layer; and a final compression boding step of further pressing the first component or the second component after the temporary fixing step to connect the first electrode and the second electrode.

Method for manufacturing connection body and method for connecting component

A sulfonium borate complex that is capable of reducing the amount of fluorine ions generated during thermal cationic polymerization, and is capable of providing a thermal cationic polymerizable adhesive with low-temperature fast curing properties is represented by a structure represented by the formula (1). In the formula (1), Ris an aralkyl group, Ris a lower alkyl group, and Ris a lower alkoxycarbonyl group. X is a halogen atom, and n is an integer of from 1 to 3.

Epoxy resin composition with sulfonium borate complex

An epoxy resin composition containing an epoxy resin and a thermal cationic polymerization initiator not only can reduce the amount of fluorine ions generated during thermal cationic polymerization to improve electrolytic corrosion resistance but also is excellent in low-temperature rapid curability. The epoxy resin composition uses a sulfonium borate complex represented by the formula (1) as the thermal cationic polymerization initiator.  In the formula (1), Ris an aralkyl group, and Ris a lower alkyl group, provided that when Ris a methyl group, Ris not a benzyl group. X is a halogen atom, and n is an integer of 1 to 3.

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Tochigi, Japan

Ryota Aizaki