Fujikoshi Machinery Corp.

Shin-etsu Handotai Co., Ltd.

Ryosuke Yoda

Michito Sato

Junichi Ueno

Hiromi Kishida

Kaoru Ishii

Yosuke Kanai

Yuya Nakanishi

Mitsuhiro Hara

Norihiko Akashio

Masaki Wada

A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.

Polishing apparatus and wafer polishing method

To provide a dressing apparatus capable of uniformly dressing a polishing pad. The apparatus includes first and second dressing grind stonesandwhich grind polishing padsandby moving in a radial direction of upper and lower polishing platesandwhile abutting on corresponding polishing padsandin which the first and second dressing grind stonesandare set so as to have: an inner side region portion P; an outer side region portion Q; and an intermediate region portion R, wherein the length of each of the inner side region portion P and the outer side region portion Q extending in a circumferential direction of the polishing platesandis longer than the length of the intermediate region portion R extending in a circumferential direction of the polishing plates.

Dressing apparatus and dressing method of polishing pad of double-side polishing apparatus

Growing community of inventors

Nagano, Japan

Ryosuke Yoda