Dow Toray Co., Ltd.

Dow Corning Toray Company, Ltd.

Dupont Toray Specialty Materials Kabushiki Kaisha

Dow Corning Co., Ltd.

Ryosuke Yamazaki

Kouichi Ozaki

Toru Imaizumi

Makoto Yoshitake

Tomohiro Iimura

Toyohiko Fujisawa

Kazuhiro Nishijima

Shinichi Yamamoto

Manabu Sutoh

Shin Yoshida

Haruna Yamazaki

Nohno Toda

Masayuki Hayashi

Hiroaki Yoshida

Provided is a curable silicone composition and uses thereof. The composition has hot-melt properties, strongly adheres to poorly adhesive substrates, and is particularly superior in flexibility and toughness at high temperatures from room temperature to approximately 150° C. in cured products such as overmolding, in addition to providing a cured product that does not easily warp or become damaged even when integrally molded with a lead frame or the like. The composition comprises: (A) organopolysiloxane resin microparticles where 20 mol % or more of all siloxane units is siloxane units represented by RSiOwhere R is a monovalent hydrocarbon group; (B) a silatrane derivative or a carbasilatrane derivative; (C) a curing agent; and (D) a functional inorganic filler. The content of component (D) is 50% or more by volume relative to the overall composition. The composition is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower.

Curable silicone composition, cured product of same, and method for producing same

Provided is a curable silicone composition and applications thereof. The curable silicone composition has hot-melt properties, excellent workability, and curing characteristics such as overmolding, and a cured product obtained therefrom does not become hard or brittle, even if left at a temperature of 150° C. or higher for a long time. The curable silicone composition comprises: an organopolysiloxane resin component which is non-hot-meltable, comprises a siloxane unit represented by SiOmaking up at least 20 mol % or more of the total siloxane units, and has a mass loss of 2.0 mass % or less when exposed to 200° C. for 1 hour; a liquid straight-chain or branched chain organopolysiloxane; and a curing agent.

Curable silicone composition, cured product of same, and method for manufacturing same

Provided is a curable silicone composition and applications thereof. The curable silicone composition has superior hot-melt properties and moldability, where the flexibility, toughness, and stress relief properties of a cured product obtained therefrom are not impaired even if a large amount of functional inorganic filler is blended in. The curable silicone composition comprises an organopolysiloxane resin component with a weight average molecular weight in a range of 2,000 to 15,000 and that contains a siloxane unit represented by SiOmaking up at least 20 mol % or more of the total siloxane units, and one or more functional fillers. The silicone resin component comprises a curing reactive functional group containing a carbon-carbon double bond, and of that curing reactive functional group, 0.05 to 1.50 mol vinyl (CH2═CH—) group is contained per 100 g of the silicone component. The curable silicone composition generally has hot-melt properties as a whole.

Curable silicone composition, cured product of same and method for producing same

Provided herein is a curable granular silicone composition which has hot-melt properties, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with an aluminum lead frame or the like. A curable granular silicone composition comprising: (A) organopolysiloxane resin microparticles having a curing reactive functional group; (B) a functional inorganic filler; and (C) a curing agent. The composition provides, upon curing, a cured material having a storage modulus at 25° C. and 150° C. of less than 2,000 MPa and less than 100 MPa, respectively, and a peak value of tan δ represented by the storage modulus/loss modulus (G'/G″), is 0.40 or more.

Curable silicone composition, cured product thereof, and method for producing same

Provided is a curable silicone composition and applications thereof. The composition has hot-melt properties as a whole, superior workability and curing characteristics such as overmolding, as well as superior flexibility and stress relief properties of a cured product thereof, even when a relatively large amount of filler is blended. Also provided is a cured product with a relatively small coefficient of thermal expansion. A curable silicone composition, comprising: an organopolysiloxane resin where 20 mol % or more of the total siloxane units of the organopolysiloxane resin is siloxane units represented by SiO; and one or more functional fillers. A vinyl (CH═CH—) group content of curing reactive functional groups containing carbon-carbon double bonds is 0.05 to 1.50 mol % per 100 g of silicone component(s) in the composition.

Provided herein is: a method of efficiently manufacturing a curable silicone sheet with excellent flatness and uniformity, containing a curable particulate silicone composition with excellent handling/workability and curing properties; and a method of manufacturing a laminate body containing the curable silicone sheet. A method of manufacturing a curable silicone sheet having hot melt properties, comprises the following steps: 1) a step of mixing organopolysiloxane resin fine particles, a curing agent, and a functional filler; 2) a step of kneading while heating and melting the mixture obtained in step 1); 3) a step of laminating the heated and melted mixture obtained in step 2) between films provided with at least one release surface; and 4) a step of stretching the laminate body obtained in step 3) between rollers to mold a curable silicone sheet having a specific film thickness.

Method for producing curable silicone sheet having hot melt properties

A curable hot-melt silicone composition that is less susceptible to curing inhibition and with excellent storage stability, and a sheet or film containing the same, is provided. The composition comprises: (A) a solid organopolysiloxane resin containing a specific ratio of (A1) an organopolysiloxane resin having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit, and (A2) an organopolysiloxane resin not having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit; (B) a chain organopolysiloxane having a curing reactive functional group that contains at least two carbon-carbon double bonds; (C) an organohydrogenpolysiloxane resin having a mass loss ratio relative to pre-exposure of 10% or less after exposure to 100° C. for 1 hour under atmospheric pressure; and (D) a hydrosilylation reaction catalyst. The composition generally has hot-melt properties.

Curable hot-melt silicone composition, cured material thereof, and laminate containing curable hot-melt silicone composition or cured material thereof

A curable particulate silicone composition is disclosed. The composition comprises: (A) hot-melt silicone fine particles having a specific reactive functional group; (B) an inorganic filler; and (C) a curing agent. The content of component (B) is in the range of from 87 to 95 vol. % of the total composition. The curable particulate silicone composition provides a cured product having an average linear expansion coefficient of not greater than 15 ppm/&#xb0; C. in a range of from 25&#xb0; C. to 200&#xb0; C. The curable particulate silicone composition provides a cured product having a very low average linear expansion coefficient over a wide temperature range when cured and is particularly suitable for overmold molding and the like.

Curable granular silicone composition, semiconductor member comprising same, and forming method thereof

Provided is a curable granular silicone composition which has hot-melt properties, is excellent in terms of handleability and curability in overmolding and the like, and gives cured objects and the like highly inhibited from taking a color at high temperatures. The curable granular silicone composition comprises: (A) organopolysiloxane resin fine particles which do not have hot-melt properties and have a curing-reactive functional group containing a carbon-carbon double bond and in which siloxane units represented by RSiO(where R is a monovalent organic group) or SiOaccount for at least 20 mol % of all the siloxane units; (B) a liquid, linear or branched organopolysiloxane having, in the molecule, at least two curing-reactive functional groups containing a carbon-carbon double bond; (C) a hardener; and (D) a functional filler. The composition as a whole has hot-melt properties. Uses of the curable granular silicone composition are also disclosed.

Curable granular silicone composition, cured object obtained therefrom, and production method therefor

A curable silicone composition for die bonding use contains at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two siloxane units each represented by the formula: RHSiO (wherein R represents a monovalent hydrocarbon group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond) per molecule, (C) a platinum-group metal-based catalyst for hydrosilylation reactions, (D) a hydrosilylation reaction inhibitor and (E) an adhesiveness-imparting agent, wherein the scorch time (ts1), which is defined in JIS K 6300-2, at a die bonding temperature is 20 to 60 seconds, and the 90% vulcanization time [tc(90)] with respect to the maximum torque value during the vulcanization time of 600 seconds is 300 to 500 seconds. The curable silicone composition for die bonding use according to the present invention can adhere a semiconductor chip to a support strongly.

Curable silicone composition for die bonding use

Provided is a curable particulate silicone composition that is hot-meltable, has excellent handling workability, curing properties, and gap fill properties when melted, and gives a cured product having excellent flexibility and resilience from room temperature to high temperatures of about 150&#xb0; C. Also provided are pellets or the like formed by molding the curable particulate silicone composition. The curable particulate silicone composition comprises: (A) hot-meltable silicone particles that have a softening point of 30&#xb0; C. or higher and have a hydrosilylatable group and/or a radical reactive group; (B) an inorganic filler (particulates) that is substantially free of coarse particles having an average particle diameter of 10.0 &#x3bc;m or larger; and (C) a curing agent. When cured, the composition gives a cured product having a storage modulus of 2000 Mpa or lower at 25&#xb0; C. and of 100 Mpa or lower at 150&#xb0; C.

Curable particulate silicone composition, semiconductor member comprising curable particulate silicone composition, and method for molding semiconductor member

The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (RSiO)(RSiO)(RSiO)(SiO). In the formula, R's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R's per molecule represent hydrogen atoms, Rrepresents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0&#x3c;a&#x3c;1, 0&#x3c;b&#x3c;1, and 0&#x2264;c&#x2264;0.2, and 0&#x3c;d&#x3c;1, respectively, but are also numbers satisfying 0.6&#x2264;a/d 1.5, 1.5&#x2264;b/d&#x2264;3, and a+b+c+d=1, and (C) a catalyst for hydrosilylation reaction. This composition has excellent adhesiveness to a semiconductor element, and can form a cured product in which only a small number of bubbles are produced.

Curable organopolysiloxane composition and semiconductor device

Disclosed is a curable organopolysiloxane composition, comprising: (A) a curing reactive organopolysiloxane component formed by curing or semi-curing and reacting at least two or more types of organopolysiloxanes in the presence of one or more types of catalysts; and (B) a peroxide. The composition is a non-fluid at 25&#xb0; C., and the melt viscosity at 100&#xb0; C. is 8000 Pa&#xb7;s or lower. A sealing agent comprising the curable organopolysiloxane composition and a cured product of the curable organopolysiloxane composition are also disclosed, along with a method of molding a cured product and a semiconductor device comprising the cured product.

Curable organopolysiloxane composition, semiconductor sealant comprising same, and semiconductor device

A primer composition is provided. The primer composition comprises: (A) an organosiloxane block copolymer represented by the average unit formula: (RSiO)(RSiO), wherein each Rand Ris independently an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, 'a' is a number in the range of 0.40 to 0.90, 'b' is a number in the range of 0.10 to 0.60, and &#x201c;a+b&#x201d;=1.00, and having 0.5 to 35.0 mol % of silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups, in which resinous siloxane blocks are connected by linear siloxane blocks; (B) a curing catalyst; and (C) an organic solvent. The primer composition improves the adhesion of silicone-cured products to base materials of optical semiconductor elements, package materials, substrates etc., and can suppress peeling or cracking caused by heat cycles.

Primer composition, adhering method, and electric/electronic part

A hot melt silicone that is non-flowable at 25&#xb0; C. and that has a melt viscosity at 100&#xb0; C. of 5,000 Pa&#xb7;s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25&#xb0; C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.

Growing community of inventors

Ichihara, Japan

Ryosuke Yamazaki