Murata Manufacturing Co., Ltd.

Ryosuke Washida

Noboru Kato

Yoshinori Yamawaki

Jyunichi Nanjyo

Yoshiki Aburatani

Narimichi Makino

A wireless communication device manufacturing system includes: a mounting apparatus including a mounting head mounted with a suction nozzle that sucks and holds an RFIC module including an RFIC chip, a terminal electrode, and a hot melt adhesive layer; a conveyance apparatus configured to convey the antenna base material including an antenna pattern to a mounting position; and a heating apparatus configured to heat the hot melt adhesive layer of the RFIC module. The wireless communication device manufacturing system bonds the RFIC module in a state where the hot melt adhesive layer is softened by heating of the heating apparatus to the antenna base material disposed at the mounting position through the hot melt adhesive layer, and capacitively couples the antenna pattern and the terminal electrode through the hot melt adhesive layer.

Wireless communication device manufacturing system

A wireless communication device is provided that includes an RFIC module having an RFIC chip and first and second terminal electrodes connected to the RFIC chip. An antenna member is provided that includes an antenna pattern having first and second coupling portions and an antenna base material on which the antenna pattern is disposed. Moreover, an insulating sticky layer is disposed between the RFIC module and the antenna member, and is provided for bonding the RFIC module to the antenna member. The first terminal electrode and the first coupling portion are capacitively coupled, with the sticky layer in between, and the second terminal electrode and the second coupling portion are capacitively coupled, with the sticky layer in between.

Wireless communication device

An RFID tag manufacturing system is provided that includes a conveyance device that conveys a base sheet provided with a plurality of antenna patterns to each of which an RFIC module is fixed. The system includes a laminating device that attaches a cover seal on the base sheet to cover the antenna patterns and a punching device that produces RFID tags by punching the cover seal and the base sheet with a punching blade that includes a frame-shaped cutting edge surrounding the antenna patterns to form a frame-shaped cut. The base sheet includes alignment mark in a non-attachment part of the cover seal. The punching device specifies the position of each of the antenna patterns covered with the cover seal based on the alignment mark, and punches the cover seal and the base sheet based on the specified position of the antenna pattern.

RFID tag manufacturing system

A material sheet is provided having antenna patterns that include first and second coupling portions that are transported toward a mounting position, and an adhesive member that is disposed on the material sheet before reaching the mounting position. At a pickup position, a mounting device picks up an RFIC module including an RFIC chip and first and second terminal electrodes connected to the RFIC chip. At the mounting position, the mounting device mounts the picked-up RFIC module onto the adhesive member on the material sheet so that the first coupling portion and the first terminal electrode face each other and so that the second coupling portion and the second terminal electrode face each other.

Wireless communication device manufacturing method and wireless communication device manufacturing apparatus

A wireless communication device is provided that includes an RFIC module in which an RFIC chip and first and second terminal electrodes are incorporated, and an antenna member including an antenna base material and antenna patterns including first and second coupling portions. The RFIC module and the antenna member are bonded to each other via an insulating first adhesive layer. Between the first terminal electrode and the first coupling portion and between the second terminal electrode and the second coupling portion, a distance tfrom a surface of the RFIC module in contact with the first adhesive layer to the first and second terminal electrodes is larger than a thickness tof the first adhesive layer.

Wireless communication device and method of manufacturing same

An electronic component includes a multilayer body including a first insulator and a second insulator having a higher resistivity than the first insulator, metal conductors each positioned between the first insulator and the second insulator and including a predetermined end surface positioned at least near an end surface of the multilayer body, plating films each provided on the predetermined end surface of the metal conductor in a state extending out in a direction covering an end surface of the first insulator by a larger distance than in a direction covering an end surface of the second insulator, and an outer conductor provided on the outer sides of the plating films and electrically connected to the metal conductor through the plating films.

Growing community of inventors

Nagaokakyo, Japan

Ryosuke Washida