Nichia Corporation

Ryosuke Wakaki

Yuta Horikawa

Yusaku Achi

Shingo Masui

Takuya Miki

Hiroto Itoi

Ken Katsuragi

Shoichi Ishikawa

Takeshi Aki

Ryohei Yamashita

Seitaro Akagawa

Toshiyuki Hashimoto

Kazumasa Kurokawa

Hiroshi Tominaga

Akira Asano

Morito Kanada

Koji Nakano

Hitoshi Nojiri

Kiyoshi Kayama

Kazuki Koda

A light-emitting device includes: a resin package; and a first light-emitting element and a second light-emitting element. The resin package includes: a resin portion; a first lead having an upper surface and an end surface; a second lead having an upper surface and an end surface; and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. The first light-emitting element and the second light-emitting element are disposed in the recess. The first lead and the second lead are arranged in a first direction. The first light-emitting element and the second light-emitting element are arranged in a second direction perpendicular to the first direction.

Light-emitting device

A light-emitting device includes a first lead having a first lateral surface, a second lead having a second lateral surface, and a resin portion. The first lateral surface of a first lead facing a second lead has a first recess that is recessed so as to be away from the second lead toward the first lead in a top view, and is continuous with an end of a first groove. The second lateral surface of the second lead facing the first lead has a second recess that is recessed so as to be away from the first lead toward the second lead in the top view, and is continuous with an end of a second groove. In the top view, a part of the resin portion is continuously disposed between the end of the first groove and the end of the second groove.

A light-emitting device includes: a resin package including: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion; and a first light-emitting element and a second light-emitting element that are disposed in the recess.

Resin package and light-emitting device

A light source device includes a package and a substrate. The package includes first and second electrodes. The first electrode has first and second parts separated from each other by a first separation region on a lower surface side of the first electrode while the first part is continuous with the second part on an upper surface side. The substrate includes a pair of wiring members. Lower surfaces of the first and second parts face and are mounted on an upper surface of one of the wiring members. A lower surface of the second electrode faces and is mounted on an upper surface of the other of the wiring members. A region of the substrate facing the first separation region has solder wettability lower than solder wettability of the upper surface of the one of the wiring members facing the first part and the second part of the first electrode.

Light source device having package including first electrode and second electrode and substrate including wiring members facing first electrode and second electrode

A light-emitting device includes a package and a light-emitting element. The package includes a pair of leads each including a main body portion and an extension portion, a resin portion holding the pair of leads, and a concave portion having a bottom surface where an upper surface of each of the pair of leads is exposed. The extension portion extends from an outer edge of the main body portion to an outer surface of the package. The light-emitting element is mounted at the bottom surface of the concave portion. The main body portion has a trench and a through-hole in a portion of the main body portion buried in a sidewall of the concave portion. The through-hole is continuous with the trench. When viewed in top-view, the through-hole is provided inward of the outer edge of the main body portion at a vicinity of the extension portion.

Light-emitting device with trench and through-hole in a pair of leads for stress reduction

A light emitting device includes a resin package having a rectangular shape in a top view and two short-side lateral surfaces and two long-side lateral surfaces. The two short-side lateral surfaces include a first external surface and a second external surface located on an opposite side from the first external surface. The two long-side lateral surfaces include a third external surface and a fourth external lateral surface located on an opposite side from the third external lateral surface. The lead is not exposed on the third external lateral surface nor the fourth external lateral surface. The first lead is exposed at the first external lateral surface and the second external lateral surface, respectively flush with the resin member at the first external lateral surface and the second external lateral surface. The second lead is exposed at the second external lateral surface, flush with the resin part at the second external lateral surface.

Light emitting device and lead frame with resin

According to one embodiment, a light emitting device includes a first lead, a light emitting element, and a first bonding member. The light emitting element includes a semiconductor stacked body and a first electrode. The semiconductor stacked body includes a light emitting layer. The first electrode is below the semiconductor stacked body. The first bonding member electrically connects the first lead and the first electrode. A lower surface of the first electrode includes a first protrusion, a second protrusion, and a first depression. The first depression is located between the first and second protrusions. The first protrusion has a first side surface. The second protrusion has a second side surface facing the first side surface. The first bonding member contacts at least a part of the first side surface. At least a part of the second side surface is separated from the first bonding member.

Light emitting device, light emitting element and method for manufacturing the light emitting element

A resin package includes: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. In a top view, the upper surface of the first lead includes a first groove overlapping a first side of the bottom surface, a second groove overlapping a second side of the bottom surface, a third groove overlapping a third side of the bottom surface, and one or more fourth grooves extending from a portion of the third groove to an end surface of the first lead facing the second lead.

A light source device includes an electronic component and a substrate. The electronic component includes first and second electrodes exposed at a lower surface. The first electrode includes first and second parts separated from each other by a separation region on the lower surface of the electronic component. The substrate includes a basal member and a first and second wiring layers disposed on an upper surface of the basal member. The electronic component is mounted to the substrate so that upper surfaces of the first and second wiring layers respectively face the first and second electrodes. The substrate includes a first region at a position overlapping the separation region as seen in a top view. Solder wettability of the substrate in the first region is lower than solder wettability of the substrate in at least regions of the first wiring layer facing the first and second parts of the first electrode.

Light source device

A backlight unit includes a light-guide plate, a light source, and a phosphor sheet including a red phosphor material. The light source includes blue light emitting diodes, and green semiconductor lasers. The red phosphor material is excited by light from the blue light emitting diodes and emits red light. The phosphor sheet is solid and disposed on a surface of a first principal plane of the light-guide plate to define a first mixing light emission surface on the first principal plane of the light-guide plate from which green light emitted from the green semiconductor lasers and blue light from the blue light emitting diodes are emitted toward the phosphor sheet and a second mixing light emission surface on the phosphor sheet from which red light emitted from the red phosphor material, green light emitted from the green semiconductor lasers, and blue light from the blue light emitting diodes are emitted.

Backlight unit and method of lighiting backlight unit

A backlight unit has a light-guide plate and a light source optically coupled with the light-guide plate, with which light is input from a plane of the light-guide plate and white-light is output from the first principal plane of the light-guide plate. The light source has a plurality of blue light emitting diodes, red phosphor material excited by light from the blue light emitting diodes and emits red light, and a plurality of green semiconductor lasers having emission peaks at green light wavelengths. The red phosphor material is included in a phosphor sheet, and the phosphor sheet is disposed on a surface of the light-guide plate.

Backlight unit and liquid crystal display device

A backlight unit has a light-guide plate and a light source optically coupled with the light-guide plate, with which light is input from a plane of the light-guide plate and white-light is output from the first principal plane of the light-guide plate. The light source has a plurality of blue light emitting diodes, red phosphor material excited by light from the blue light emitting diodes and emits red light, and a plurality of green semiconductor lasers having emission peaks at green light wavelengths.

A semiconductor device includes a mounting substrate with a land having a first surface and a second surface higher than the first surface, a side-emission type light emitting device including an external connecting terminal disposed on the first surface, and a bonding member disposed at least on the second surface to bond the external connecting terminal and the land.

Semiconductor device

A resin package includes a molded resin housing, a first lead, and a second lead. The molded resin housing includes a cavity open upward. The cavity includes an inner surface. The inner surface includes a curved portion and a stepped portion provided on a lower side of the curved portion. The first lead and the second lead are provided in a bottom portion of the cavity such that at least a part of the first lead and the second lead is exposed from the molded resin housing. The first lead includes an elevated portion on which a light emitting element is mounted. An upper surface of the elevated portion is provided higher than an upper end portion of the stepped portion.

Growing community of inventors

Tokushima, Japan

Ryosuke Wakaki