Sanyo Electric Co., Ltd.

Ryosuke Usul

Yasunori Inoue

Takeshi Nakamura

Hideki Mizuhara

Yusuke Igarashi

Yasuhiro Kohara

Nobuhisa Takakusaki

A circuit device including a multilayer wiring structure having an improved heat radiation performance, and a manufacturing method thereof is provided. A circuit device of the invention includes a first wiring layer and a second wiring layer laminated while interposing a first insulating layer. The first wiring layer is connected to the second wiring layer in a desired position through a connecting portion formed so as to penetrate the first insulating layer. The connecting portion includes a first connecting portion protruding in a thickness direction from the first wiring layer, and a second connecting portion protruding in the thickness direction from the second wiring layer. The first connecting portion and the second connecting portion contact each other at an intermediate portion in the thickness direction of the insulating layer.

Circuit device and manufacturing method thereof

In a manufacturing method of a hybrid integrated circuit deviceaccording to the present invention, a first dummy pattern Dis provided on a first wiring layerA. Furthermore, a second dummy pattern Dis provided on a second wiring layerB. The first dummy pattern Dand the second dummy pattern Dare connected through a connection partwhich penetrates an insulation layer. Hence, heat dissipation through a dummy pattern can be actively performed. In addition, even in the cases where a multi-layered wiring is formed, it is possible to provide a circuit device which can secure a heat dissipation property.

Circuit device with dummy elements

Growing community of inventors

Aichi, Japan

Ryosuke Usul