Hitachi, Ltd.

Ryosuke Mizutori

Hideo Nakamura

Akio Igarashi

Yoshitsugu Miyamoto

Katsuyoshi Watanabe

Hirokuni Kurihara

Junichi Matsui

A solder ball printing apparatus fills plural openings formed in a mask with solder balls using a squeegee and prints the solder balls on plural electrode portions formed on a surface of a substrate facing the mask. The solder ball printing apparatus includes: a substrate mounting table on which the substrate is mounted and on the back surface side of which plural hole portions are formed; a print table on which the substrate mounting table is mounted; an XY&#x3b8; stage which can drive the print table in a horizontal plane; a print table cylinder which can vertically drive the print table; a mask absorption portion which has members that can be fitted into the substrate mounting table; and a mask absorption cylinder which can vertically drive the mask absorption portion.

Solder ball printing apparatus and solder ball printing method

A film paid out from a feed side film roll is conveyed so that an application target area of the film is located on a suction table in an application portion. Image-capturing cameras are disposed so as to be adjacent to ink-jet application heads so that one application head and one image-capturing camera are integrated with each other in terms of position of installation to form one application head unit portion. Each application head unit portion is moved above the suction table by a three-dimensionally movable XYZ-direction driving unit. A position where application will be performed next is image-captured by each of the image-capturing cameras in advance during the applying operation due to each of the application heads. A result of image capturing by each of the image-capturing cameras is processed by an image processing unit.

Ink-jet application apparatus and method

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Toyko, Japan

Ryosuke Mizutori