Panasonic Intellectual Property Management Co., Ltd.

Ryosuke Meshii

Takashi Kubo

Kensaku Yamamoto

Hitoshi Yoshida

Naoto Onodera

Toshinari Noda

Hiroki Kamiguchi

Kazuo Goda

Takanori Aoyagi

Shoichi Taji

Nobuo Sashinaka

Takahiro Shinohara

Naoki Ota

A wiring-buried glass substrate includes a glass substrate and a first wiring. The glass substrate includes a first surface, a second surface perpendicular to the first surface, and a third surface facing the first surface. The first wiring includes a first pillar portion and a first beam portion. The first pillar portion extends in a first direction perpendicular to the first surface of the glass substrate. The first beam portion is connected to a first surface of the first pillar portion and extends to a second direction perpendicular to a second surface of the glass substrate. The first wiring is buried in the glass substrate. The first surface of the first beam portion is exposed from a third surface of the glass substrate.

Wiring-buried glass substrate, and inertial sensor element and inertial sensor using same

An infrared ray detecting element includes: a substrate having a cavity; an infrared ray detecting portion including, sequentially stacked, a lower electrode layer, a detection layer, and an upper electrode layer; first and second support portions which support the infrared ray detecting portion above the cavity; and first and second external lead portions for leading electrical signals outputted from the infrared ray detecting portion, to the outside. The first support portion includes, sequentially stacked, a first upper wiring pattern, a first insulating layer, and a first lower wiring pattern. The upper electrode layer is connected to the first external lead portion via the first upper wiring pattern. The second support portion includes, sequentially stacked, a second upper wiring pattern, a second insulating layer, and a second lower wiring pattern. The lower electrode layer is connected to the second external lead portion via the second lower wiring pattern.

Infrared ray detecting element and infrared ray detector including the same

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Osaka, Japan

Ryosuke Meshii