Denso Corporation

Ryosuke Izumi

Hiroyuki Yamakawa

Hodaka Mori

Motomi Ishikawa

Norihito Yoshida

Hiroyuki Okuhira

Takashige Saito

Kouji Yamamoto

Tomoyuki Harada

Yuuichi Ikuno

Noritaka Inoue

A synthetic resin molded article includes an electric element part extending in a distal direction and a primary molded part. The primary molded part has an element covering portion and a body portion. The element covering portion has a distal end surface exposed in the distal direction and a first side surface extending in a proximal direction opposite to the distal direction. The element covering portion covers a proximal portion of the electric element portion, and a distal end portion of the electric element portion projects from the distal end surface in the distal direction. The body portion has an intermediate surface exposed in the distal direction and a second side surface extending in the proximal direction. The body portion is disposed on a side of the element covering portion in the distal direction and is integrally connected to the element covering portion.

Synthetic resin molded article and method for producing the same

A resin molded article includes an insert component and a synthetic resin member sealing the insert component. The insert component is provided by a primary molded product of a thermosetting resin, or a metal component, and has a functional group. The synthetic resin member is provided by a synthetic resin including a base polymer of a thermoplastic resin and a bonding component bonding with the functional group included in the insert component. The synthetic resin member has a sea structure formed of a continuous phase including the base polymer, and at least a part of the bonding component is present as a dispersed component in the sea structure. The dispersed component bonds with the functional group included in the insert component.

Resin molded article and method for manufacturing the same

A part of the sealed surface of the thermosetting resin member is a non-roughened surface that is not subjected to a roughening treatment. The other part of the sealed surface is a roughened surface recessed from the non-roughened surface to form a step and more roughened than the non-roughened surface. The thermoplastic resin member includes an additive added thereto, and the additive contains a functional group. A functional group existing in the roughened surface and the functional group existing in the additive are chemically bonded together. The roughened surface has a closed-circular shape that is formed over an entire circumference of the sealed surface around an axis parallel to the first direction. The three or more roughened surfaces each having a closed-circular shape on the sealed surface are arranged along the first direction with the non-roughened surface interposed as a distance between each adjacent two of the roughened surfaces.

Resin molded body

A surface boundary is formed between a sealed surface of a thermosetting resin member and a thermoplastic resin member to seal the sealed surface. A newly formed surface is formed at the surface boundary by removing a surface layer in the sealed surface. A functional group in the newly formed surface is chemically bound to a functional group in a functional group-containing additive added to a constituent material of the thermoplastic resin member.

Manufacturing method of a resin molded article

An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.

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Kariya, Japan

Ryosuke Izumi