Kyocera Corporation

Kyocera Crystal Device Corporation

Ryoma Sasagawa

Hidefumi Hatanaka

Hiroyuki Miura

Hironobu Shintoku

Jumpei Komura

Takahiro Niiyama

A piezoelectric deviceis provided with an element-mounting member, a piezoelectric elementmounted on the element-mounting member, a metal patternwhich is formed at the surface of the element-mounting memberand includes an element-mounting regionand a lead region, and an integrated circuit elementwhich is electrically connected to the element-mounting regionof the metal patternby solder bump, wherein the metal patternhas a projecting partwhich is provided between the element-mounting regionand the lead region, and at least the surface portion of the projecting partis made of a metal oxide.

Piezoelectric device

An inventive temperature-compensated crystal oscillator has a construction such that a crystal oscillator element () is accommodated in a container () and an IC element () for controlling an oscillation output on the basis of the oscillation of the crystal oscillator element () is mounted on a lower surface of the container (). A plurality of electrode pads () at least including plural crystal electrode pads connected to the crystal oscillator element (), plural writing control electrode pads, and an oscillation output electrode pad, a ground electrode pad, a power source voltage electrode pad and an oscillation control electrode pad connected to surface mounting external terminals are arranged in a matrix configuration of m rows&#xd7;n columns (wherein m and n are natural numbers not smaller than 2) in an IC element mounting area. The IC element () is electrically connected to the electrode pads (). The temperature-compensated crystal oscillator is excellent in IC element bonding reliability, and meets the need for the size reduction of the entire structure.

Temperature-compensated crystal oscillator

A method for manufacturing a piezoelectric oscillator. The method having the step of preparing a master substrate partitioned into plural substrate regions. Mounting on each of the substrate regions a piezoelectric vibrator and an IC for controlling an oscillation output of the piezoelectric vibrator. The master substrate is then divided into individual substrate regions by cutting the master substrate on the outside circumferences of the individual substrate regions, thereby obtaining a plurality of piezoelectric oscillators.

Method for manufacturing a piezoelectric oscillator

A quartz-crystal oscillator has a configuration wherein a rectangular containeraccommodating a piezoelectric oscillator devicetherein is fixed to a rectangular supporting substrateon which an IC deviceis mounted via spacer membersformed of metal bodies. On the surface of the supporting substrate, part or all of the IC deviceand side faces of the spacer members are coated with a resin material. When the quartz-crystal oscillator is implemented on a main board by soldering or the like, the problem that the solder for bonding the quartz-crystal oscillator to the main board is adhered to the spacer members, thereby causing a short-circuit can be effectively prevented.

Growing community of inventors

Kagoshima, Japan

Ryoma Sasagawa