Disco Corporation

Ryoko Fujiya

Hiroyuki Takahashi

Tomohiro Yamada

Yoshiteru Nishida

Hidekazu Iida

Kenta Chito

Susumu Yokoo

Yoshiyasu Nakagawa

An electrostatic chuck is provided and has a holding surface for holding a wafer with a tape attached to one side of the wafer where the tape is in contact with the holding surface. The electrostatic chuck includes a disk-shaped member having a plurality of fine holes communicating with a vacuum source, where the fine holes are exposed to the holding surface. The disk-shaped member also includes a plurality of asperities formed on the holding surface and connected to the fine holes, and an electrode embedded in the disk-shaped member. The vacuum source is operated to produce a vacuum on the holding surface through the fine holes and thereby hold the wafer through the tape on the holding surface under suction, where the asperities formed on the holding surface function as a suction passage communicating with the fine holes.

Electrostatic chuck

Disclosed herein is a grinding wheel including a wheel base to be fixed to a spindle, a plurality of abrasive members fixed to the wheel base, and a plurality of grinding water supply holes for supplying a grinding water to the abrasive members. Each abrasive member is formed as a segment abrasive having an outer surface extending downward from the lower surface of the wheel base so as to be inclined radially outward. The plural abrasive members are arranged annularly at given intervals. The plural grinding water supply holes are formed on the lower surface of the wheel base in the vicinity of the abrasive members so as to each correspond to the abrasive members in the condition where each grinding water supply hole lies on a line connecting the corresponding abrasive member and the axis of rotation of the wheel base.

Grinding wheel and grinding method

Growing community of inventors

Tokyo, Japan

Ryoko Fujiya