Jsr Corporation

Ryoji Tatara

Toshiaki Kadota

Nobuyuki Miyaki

Yuki Kitamura

Teruhiko Umehara

Yuuya Nawate

Ryouta Tsuyuki

Kimiyuki Kanno

An object of the present invention is to provide a photosensitive resin composition that can form an insulating film having low dielectric constant and low dielectric loss tangent and undergoing small changes in elongation properties in response to changes in environmental temperature. The photosensitive resin composition of the present invention contains: a polymer (A) having a structural unit (a1) represented by Formula (a1); a crosslinking agent (B); a photocation generator (C); and a compound (D) represented by Formula (D).

Photosensitive resin composition

A polymer includes a first structural unit represented by formula (1-1), (1-2) or (1-3) and a second structural unit represented by formula (2) or (3). In the formulae (1-1) to (1-3), (2) and (3), R, Rand Reach represent a halogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms, a nitro group or a cyano group; Zs each represent &#x2014;O&#x2014; or &#x2014;S&#x2014;; Rs each represent a methylene group or an alkylene group having 2 to 4 carbon atoms; and L represents a divalent group represented by formula (2-1). In the formula (2-1), Rrepresents a divalent alicyclic hydrocarbon group having 5 to 30 ring atoms or a divalent fluorinated alicyclic hydrocarbon group having 5 to 30 ring atoms. 

Polymer, resin composition and resin molded product

Growing community of inventors

Tokyo, Japan

Ryoji Tatara